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Ti target material and Al backboard welding method

A welding method and technology of the back plate, applied in the direction of welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems that heavy pressure cannot be applied, diffusion welding method cannot be used, and it is easy to break apart, so as to achieve the effect of improving the bonding ability

Inactive Publication Date: 2011-05-18
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since there are water channels on the Al back plate, heavy pressure cannot be applied, so the diffusion welding method cannot be used
When brazing with welding materials, due to the large difference in thermal expansion coefficients of Ti and Al (the thermal expansion coefficient of Ti is 10.8, and the thermal expansion coefficient of Al is 23.2), the general welding materials are easy to collapse during the cooling process, and the wetting effect is not good. Very good, resulting in a low degree of bonding between the target and the backplane, and even the phenomenon that the target falls off the backplane

Method used

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  • Ti target material and Al backboard welding method
  • Ti target material and Al backboard welding method
  • Ti target material and Al backboard welding method

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Embodiment 1

[0034] refer to figure 1 , figure 1 It is a schematic flowchart of a welding method for a titanium target aluminum back plate provided by an embodiment of the present invention. The method specifically includes:

[0035] Step S1: providing a target material and a back plate, the target material is a Ti target material, and the back plate is an Al back plate.

[0036] In the embodiment of the present invention, the target material is a Ti target material, and the back plate is an Al back plate. The shape of the target can be determined according to specific needs, for example, the surface of the target can be set to be triangular, rectangular or circular.

[0037] Step S2: forming a nickel layer on the welding surface of the Ti target.

[0038] Since the thermal expansion coefficients of Ti and Al are quite different (the thermal expansion coefficient of Ti is 10.8, and the thermal expansion coefficient of Al is 23.2), when the Ti target and the Al back plate are combined b...

Embodiment 2

[0043] The method for welding the titanium target aluminum back plate provided by the present invention will be described in detail below with a specific embodiment. refer to figure 2 , figure 2 It is a schematic flow chart of another method for welding a titanium target aluminum back plate provided by the embodiment of the present invention, and the method is specifically as follows:

[0044] Step S1: providing a target material and a back plate, the target material is a Ti target material, and the back plate is an Al back plate.

[0045] refer to image 3 , the surface of the Ti target described in this embodiment is in the shape of a triangle, the bottom b of the triangle is 352.044 mm, the height a is 387.35 mm, the thickness of the Ti target is 10 mm, and a margin of 2 mm is added to the thickness of the 10 mm, The purpose of increasing the margin is to prevent the serious shrinkage of the Ti target during the cooling process and affect the subsequent processing step...

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Abstract

The embodiment of the invention discloses a Ti target material and Al backboard welding method, comprising the following steps: providing a target material and a backboard, wherein the target material is a Ti target material, and the backboard is an Al backboard; forming a Ni layer on the welding surface of the Ti target material; and combining the Ti target material provided with the Ni layer with the Al backboard by using the brazing method. Because the Ni layer is formed on the welding surface of the Ti target material, and the Ni layer and a welding material can be well wetted and combined, the Ti target material and Al backboard combining capacity can be improved, and the Ti target material can not fall off from the Al backboard.

Description

technical field [0001] The invention relates to the technical field of optical coating, in particular to a method for welding a titanium target aluminum back plate. Background technique [0002] In the field of large-scale optical coating, target components are often used to perform plasma vapor deposition (Plasma Vapor Deposition, PVD) coating on the surface of the substrate to form a barrier layer. The target assembly is composed of a target meeting the sputtering performance and a back plate combined with the target and having a certain strength. The back plate can play a supporting role when the target assembly is assembled to the sputtering base station, and has the effect of conducting heat. [0003] In the sputtering process, the working environment of the target assembly is generally harsh. For example, the working temperature of the target assembly is high, which can reach 300 ° C ~ 500 ° C; in addition, one side of the target assembly is filled with cooling water,...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K1/20
Inventor 姚力军潘杰王学泽李响
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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