Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for separating VSP (vertical seismic profiling) wave field based on parametric inversion during seismic profile data processing

A technology of wave field separation and parameter inversion, which is applied in seismic signal processing and other directions, and can solve problems affecting the speed of separation

Active Publication Date: 2011-05-11
CHINA PETROLEUM & CHEM CORP +1
View PDF6 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Emil Blia proposed a wave-by-wave iterative separation method in "VSP wavefield separation: wave by wave optimization approach", but human intervention is required for each separation, which affects the speed of separation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for separating VSP (vertical seismic profiling) wave field based on parametric inversion during seismic profile data processing
  • Method for separating VSP (vertical seismic profiling) wave field based on parametric inversion during seismic profile data processing
  • Method for separating VSP (vertical seismic profiling) wave field based on parametric inversion during seismic profile data processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0055] The effective signals in VSP data include upgoing P wave, downgoing P wave, upgoing SV wave and downgoing SV wave, which have different incident angles, propagation speeds and waveforms.

[0056] The present invention assumes: (1) the record of each depth point in the VSP data is made of above-mentioned wave field, has respective propagation velocity, incident angle and waveform (if knowing these three parameters of propagation velocity, incident angle and waveform, just The wave field can be reconstructed); (2) The same type of wave field recorded by the receiver point in the same depth segment has the same propagation velocity, incident angle and waveform, that is, isotropy, such as figure 2 shown.

[0057] Under this assumption, the wave fields of other geophones in the same depth range can be regarded as the result of the wave field of the central ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for separating a VSP (vertical seismic profiling) wave field based on parametric inversion during seismic profile data processing and belongs to the field of vertical seismic profiling data processing. In the method, without regarding to the anisotropic influence, the speeds and incidence angles of a P wave and an SV (shear vertical) wave within a depth scope are assumed as constant, wherein the wave field is composed of the P wave and the SV wave; a wave field reconfiguration equation for each receiving point is established; the speeds and incidence angles of the P wave and the SV wave are obtained by inversion; the waveforms of the P and SV waves are calculated; and the purpose of separating the wave field is achieved by reconfiguring the wave field. A parametric inversion method is adopted in the invention and the VSP data is separated by reconfiguring the wave field, so as to efficiently separate the VSP data subjected to a serious mixing phenomenon. The signal to noise ratio (SNR) of a separated result is high, the resolution ratio is high, the fidelity is high, and the wave field is single.

Description

technical field [0001] The invention belongs to the field of vertical seismic section data processing, in particular to a method for separating VSP wave fields based on parameter inversion. Background technique [0002] The challenges faced by today's exploration and development work require high-precision, high-definition and high-confidence technology, and VSP (Vertical Seismic Profiling) technology is one of the available methods. Accurate information of VSP data can be used to analyze velocity, eliminate multiple waves, and improve the accuracy of surface data imaging processing, so as to provide reliable drilling target geological body position and depth, and avoid the occurrence of drilling off-target and missed targets. Accurate information of VSP data and the effect of wave field separation are inseparable. [0003] In the VSP wave field separation, conventional wave field separation has problems such as wave mixing, low frequency and amplitude distortion, which bri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01V1/28G01V1/30
Inventor 彭代平殷厚成陈林常鉴
Owner CHINA PETROLEUM & CHEM CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com