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Heat-conducting piece

A technology of guide and heat dissipation surface, applied in the direction of laminated components, heat exchange equipment, lighting and heating equipment, etc., can solve the problem that the assembly height is not easy to reduce

Inactive Publication Date: 2011-05-11
SUNONWEALTH ELECTRIC MACHINE IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a heat guide to solve the problem that the assembly height between the existing heat dissipation systems is not easy to be reduced after being combined with various heat sources.

Method used

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  • Heat-conducting piece
  • Heat-conducting piece
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Examples

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Embodiment Construction

[0033] In order to make the above-mentioned and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:

[0034] Please refer to Figure 5 As shown, the heat conducting member 1 of the first embodiment of the present invention at least includes a heat conducting sheet 11 , an extending sheet 12 and a connecting sheet 13 . The heat conducting sheet 11 has a first heat dissipation surface 111; the extension sheet 12 has a second heat dissipation surface 121; the opposite ends of the connecting sheet 13 are respectively provided with a first joint portion 131 and a second joint portion 132, the first joint portion 131 and a second joint portion 132 respectively. A joint portion 131 connects one peripheral edge of the heat conduction sheet 11, and the second joint portion 132 connects one side peripheral edge of the exte...

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Abstract

The invention relates to a thermal conductance piece, comprising a heat-conducting strip, at least one extending strip and at least one connection strip, wherein the heat-conducting strip is provided with a first heat-dissipation face; at least one extending strip is provided with a second heat-dissipation face; and at least one connection strip is used for connecting at least one extending strip and the heat-conducting strip mutually. The first heat-dissipation face of the heat-conducting strip and the second heat-dissipation face of at least one heat-dissipation strip are non-coplane; and when the heat-conducting strip is applied to a heat-dissipation system, the assembly height after the mutually combination of the heat-dissipation system and various heat sources is reduced.

Description

technical field [0001] The present invention relates to a thermal guide, in particular to a thermal guide applicable to various heat dissipation systems as a conduction medium between the heat dissipation system and the heat source. Background technique [0002] Various electronic products currently on the market, such as: lamps, monitors or computer-related products (such as central processing units, display cards, various chips, etc.), are prone to high heat during actual work; therefore, the above-mentioned various electronic products The product is usually combined with a cooling system, and uses the cooling system to dissipate heat, so as to prolong the service life of the electronic product. [0003] Existing heat dissipation systems are generally composed of several heat dissipation components with heat dissipation effects, such as: heat dissipation pipes, heat dissipation fins, heat dissipation fans, heat dissipation fins, etc.; thereby, by using the assembly and coo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F3/00H05K7/20F21V29/00F21V29/70
Inventor 洪银树廖津均柯孟宏
Owner SUNONWEALTH ELECTRIC MACHINE IND
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