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Apparatus and method for vertically-structured passive components

A technology of passive components and electronic devices, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., to achieve the effect of reducing bridging and/or insufficient soldering and reducing the area

Active Publication Date: 2011-05-04
WINTEC IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reduced size will make traditional passive components less likely to be soldered to target platforms such as PCBs due to insufficient soldering or bridging problems

Method used

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Embodiment Construction

[0051] Preferred embodiments of the present invention will be described with reference to the various drawings, where like numbers refer to elements that are identical or functionally similar. Also in illustrations, the leftmost digit of each number corresponds to the illustration in which that number is first used.

[0052] "A specific embodiment" or "a specific embodiment" mentioned in the specification means that a feature, structure or characteristic described in relation to the specific embodiment is included in at least one specific embodiment of the present invention. The phrases "in a specific embodiment" or "a specific embodiment" appearing in different places in the specification do not necessarily refer to the same specific embodiment.

[0053] In addition, in the description, the selection of words is based on the principle of easy reading and description, and is not used to limit or restrict the object of the present invention. Therefore, the disclosure of the pr...

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Abstract

A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular toa plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Description

[0001] This application claims priority to Provisional Application No. 61 / 251,617, filed October 14, 2009, which is hereby incorporated in its entirety. technical field [0002] The invention relates to an electronic component, in particular to a device of a vertical structure passive component that reduces the area occupied by the passive component on a target platform, and a packaging and assembly method thereof. Background technique [0003] Semiconductor components are usually manufactured using a ball grid array (BGA) package, in which metal solder balls composed of tin, silver and copper are pre-soldered on the pad contacts of a component package to seal the semiconductor The components are soldered to a target platform (eg, printed circuit board "PCB"). Semiconductor components are also often manufactured in a leadless grid array (LGA) package. The solder pad contact points of this package are not provided with solder balls, but a thin layer of solder paste is pre-pri...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/488H01L21/60
CPCH01L2924/0002
Inventor 陈拱辰
Owner WINTEC IND INC
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