Copper-clad board and production method thereof

Abstract

The invention relates to a copper-clad board and a production method thereof. The copper-clad board comprises at least one layer of glass fiber-reinforced prepreg, glass fiber paper-reinforced prepregs and copper foils, wherein the glass fiber paper-reinforced prepregs are compounded on two sides of the glass fiber-reinforced prepreg; and the copper foils are compounded on the glass fiber-reinforced prepreg. The copper-clad board has a novel structure; compared with the traditional FR-4(Fiber Epoxy Resin-4), CEM-3 (Composite Epoxy Material Grade-3) and the like, the copper-clad board has the advantages that the probability of weavy grain white points of a substrate is greatly reduced and the heat resistance and the electrical reliability of the copper-clad board are improved; and the copper-clad board has lower bending strength and better bendability and flexibility and better meets the requirement for the development of the modern electronic technology. In addition, the production method of the copper-clad board is simple and feasible.

Description

technical field [0001] The invention relates to a copper clad laminate, in particular to a copper clad laminate with a novel structure and a manufacturing method thereof. Background technique [0002] The prepreg on the surface of the base material of traditional FR-4, CEM-3 and other copper clad laminates is made of glass fiber cloth (referred to as glass fiber cloth) as a reinforcing material. Due to the weaving characteristics of glass fiber cloth - there will be Overlapping, the resin content at the overlapping place is relatively low, and the thickness of the resin layer is thinner than other positions. When the thickness of the resin layer on the surface of the glass fiber cloth is less than 5 μm, it is easy to appear at the interface position in contact with the copper foil. point. However, the appearance of textured white spots on the CCL substrate will affect the heat resistance and electrical reliability of the CCL and even the printed circuit board. In the conte...

AI Technical Summary

Problems solved by technology

[0002] The prepreg on the surface of the base material of traditional FR-4, CEM-3 and other copper clad laminates is made of glass fiber cloth (referred to as glass fiber cloth) as a reinforcing material. Due to the weaving characteristics of glass fiber cloth - there will be Overlapping, the resin content at the overlapping place is relatively low, and the thickness of the resin layer is thinner than other positions. When the thickness of the resin layer on the surface of the glass fiber cloth is less than 5 μm, it is easy to appear at the interface position in contact with the copper foil. point

However, the appearance of textured white spots on the CCL substrate will affect the heat resistance and electrical reliability of the CCL and even the printed circuit board. Against the background of globalization, this problem has become more prominent

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