Slice-bearing table device with internal hoistable support column

Abstract

The invention claims a slice-bearing table device with an internal hoistable support column, relating to the field of wafer conveying in semiconductor industry. The slice-bearing table device with the internal hoistable support column is used for conveying a wafer between a manipulator and a slice-bearing table and is provided with a slice-connecting support column, the slice-bearing table and anair supply rotating joint, wherein the slice-bearing table is a concave groove structure; a cavity body is arranged in the side of the slice-bearing table; a pipeline communicated with the cavity is arranged at the bottom of the slice-bearing table; a rotating joint communicated with the pipeline is arranged at the bottom of the slice-bearing table; a support column for connecting the wafer is arranged in the cavity; and one end of the support column extends from the top of the cavity. The invention solves the problem that an additional wafer transmission mechanism must be used in the prior art, and a gap between the wafer and the slice-bearing table can be adjusted through adjusting the hoisting of the support column. When the manipulator takes and delivers the wafer, the support column can be hoisted to increase the distance between the wafer and the manipulator for conveniently taking and delivering the wafer. The support column can be reduced after the action of placing the wafer is completed, and the distance between the wafer and the slice-bearing table can be reduced to meet the corresponding process requirement.

Description

technical field [0001] The invention relates to the field of wafer transfer in the semiconductor industry, in particular to a chip carrier device with built-in liftable pillars. It is a device for transferring wafers between the manipulator and the wafer table. The pillars on the wafer table can be lifted to meet the space required by the manipulator for picking up and delivering wafers. When the wafer is placed, it can be lowered to lower the wafer and the wafer. The distance between the tables can be adjusted to meet the corresponding process requirements, and the two positions of the pillars can be switched automatically. Background technique [0002] At present, the known wafer transfer technology between the manipulator and the wafer stage is mainly completed by the lifting of the manipulator, and the pillar on which the wafer is placed is fixed, which requires that the gap between the wafer and the wafer stage should be sufficient Large, for the action of the manipula...

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Problems solved by technology

[0003] In order to overcome the above-mentioned deficiencies, the object of the present invention is to provide a wafer stage device with a built-in liftable pillar, which solves the problems of having to use an additional wafer transfer mechanism in the prior art, wasting time and cost, etc. It is an automatic adjustment wafer The wafer table device with the distance between the wafer table and the wafer table can automatically switch the distance between the wafer and the wafer table through the lifting of the pillar, which is convenient and quick

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