Etching device and etching method

Abstract

The invention relates to an etching device and an etching method. The etching device comprises a spray pipe and a liquid scrapping device, wherein the spray pipe is provided with a plurality of spray heads; the plurality of spray heads are used for spraying etching liquid to a surface to be etched of a circuit substrate; and the liquid scrapping device is used for scrapping the etching liquid deposited in a center area of the surface to be etched out of the surface to be etched in a sliding mode. The etching method comprises the following steps of: using the plurality of spray heads arranged on the spray pipe to spray the etching liquid towards the surface to be etched of the circuit substrate; and using the liquid scrapping device to scrap the etching liquid deposited in the center area of the surface to be etched out of the surface to be etched in a sliding mode. The etching method can avoid generating water pit effect.

Description

technical field [0001] The invention relates to the technical field of etching, in particular to an etching device and an etching method used in a circuit board etching process. Background technique [0002] The etching process is the basic process of circuit board production, which refers to the process of using etching solution to etch away the copper that is not protected by the resist layer on the circuit board, and finally forms a conductive line. [0003] With the rapid development of electronic technology, the integration of circuit boards is getting higher and higher, and the conductive lines of the circuit board are made more and more finely, which requires the dimensional tolerance of the conductive lines of the same circuit board to be as small as possible, that is, the etching process in the etching process The effect needs to be as consistent as possible. [0004] The horizontal wet process production line has a high degree of automation and low cost, and is wi...

AI Technical Summary

Problems solved by technology

[0005] However, when using this etching device to etch the circuit substrate, due to the consistent spray pressure of each nozzle, the etching liquid will flow out of the board from the edge area of ​​the circuit substrate, and accumulate in the central area of ​​the circuit substrate, forming a pool, resulting in a pool effect

The pool effect will cause the etchant in the central area of ​​the circuit substrate to update slowly, and the accumulated etchant film will reduce the amount of erosion on the circuit, which is prone to insufficient etching of the circuit, while the etchant in the edge area of ​​the circuit substrate flows fast. The update is faster, and the line over-eclipse is prone to occur

That is, the pool effect will lead to uneven etching of the circuit substrate, especially easily lead to uneven circuit width of the final circuit board, and the conductive circuit connection in the central area

In order to obtain sufficient line width, excess line width has to be reserved for the circuit board edge area, which greatly reduces the line density of the circuit board

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