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Method for stripping wire by using laser

A laser stripping and wire technology, applied in the direction of circuit/collector parts, electrical components, circuits, etc., can solve the problems of non-conductive inner core, low yield, inner core damage, etc., and achieve fast wire stripping speed and yield. The effect of high and low processing cost

Inactive Publication Date: 2011-01-19
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional wire stripping technology is mainly based on the tool stripping method. This method is contact processing, which is very easy to cause incomplete stripping of the inner core or damage to the inner core due to too deep cutting, and the yield rate is low.
The ordinary laser stripping method is easy to cause the inner core to adhere to the non-metallic material due to the characteristics of the Teflon material that is easy to adhere to the inner core, resulting in the non-conductive processing defect of the inner core.

Method used

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Examples

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Embodiment Construction

[0010] The best embodiment of the present invention is described in further detail below.

[0011] An embodiment of the present invention provides a method for laser stripping wires, including a stripping system, a laser stripping software system, and a workbench. location; the laser wire stripping software system has designed the wire stripping program; use the wire stripping system to strip the wire.

[0012] The method for implementing the described laser stripping wire in the present invention, one of the best implementations is to use a process to strip the wire, and use a bifocal lens to focus the laser beam on two points on the same straight line with a specific energy ratio. The energy means that the ratio of the double focus to the total energy can be adjusted from 10% to 90%, and the different energy ratios can be adjusted according to the needs, so that the wire moves in a straight line on the two focus points at the position to be stripped to complete the stripping...

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PUM

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Abstract

The invention provides a method for stripping a wire by using laser. In the method, a wire-stripping system, a laser wire-stripping software system and a workbench are provided. The method comprises the following steps of: fixing the wire on a fixture of the workbench and transmitting the wire to a stripping position; designing a wire-stripping program by using the laser wire-stripping software system; and stripping the wire by using the wire-stripping system. The wire-stripping processing method of the invention has the advantages of high yield, high wire-stripping speed, low processing cost and environmental protection.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a method for stripping wires. Background technique [0002] The modern electronic manufacturing industry is developing rapidly. Although the circuit board integration technology is constantly improving, the connections between electronic devices are still ubiquitous. With the precision manufacturing of electronic equipment and the stability of the overall operation of the equipment, the reliability requirements are increasing, and the quality of the stripping at the connection joint is very important. The stripping technology based on the laser system is designed to meet this need. The traditional wire stripping technology is mainly based on the tool stripping method. This method is contact processing, which is very easy to cause incomplete stripping of the inner core or damage to the inner core due to too deep cutting, and the yield rate is low. However, the ordinary laser strip...

Claims

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Application Information

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IPC IPC(8): H01R43/28
Inventor 宋章良郭炜高云峰
Owner HANS LASER TECH IND GRP CO LTD
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