Online measurement method of contact resistance of probe

Abstract

The invention provides an online measurement method of the contact resistance of a probe, which comprises the following steps of: connecting a probe card with a chip to be tested and a testing machine, directly connecting a measuring probe on the probe card with a bonding pad on the chip to be tested, and connecting the bonding pad with a first wire and a second wire; adding a testing probe, and connecting the testing probe with the first wire; applying a voltage to the second wire, and measuring the current value on the second wire; measuring the voltage value of the terminal of the first wire as the voltage value on the testing probe; dividing the difference between the voltage value applied to the second wire and the voltage value on the testing probe by the current value on the second wire to obtain the resistance on the measuring probe; calculating the voltage correction value on the bonding pad of the tested chip according to the resistance; and applying a corrected voltage to the bonding pad of the tested chip. The measurement method provided by the invention can be used for measuring the resistance on the measuring probe in real time so as to provide the corrected voltage, measurement error caused by a change in the resistance of the probe is reduced, and the accuracy of measurement is increased.

Description

technical field [0001] The invention relates to a method for measuring an integrated circuit chip, in particular to an online method for measuring probe contact resistance. Background technique [0002] In chip testing of integrated circuits, probe cards must be used as the interface between the chip under test and the testing machine. In the usual test, a known signal is input into the chip under test, and then the reflection of the chip to the input signal is measured. The probe goes to the pad (PAD) of the chip under test, and returns according to the original path. The probes on the probe card are directly connected to the pads of the chip under test. Among the existing wafer tests, especially high-temperature wafer tests, as the number of needle sticks increases, the probes are slowly oxidized and stained. The contact resistance of the probe will gradually increase. The contact resistance of the probe depends to a large extent on the material and shape of the probe, t...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problem in the prior art that the test probe resistance is easily changed and affects the measurement accuracy, the present invention provides a measurement method that increases the measurement accuracy

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