Perforation processing method for printing substrate

Abstract

The invention provides a perforation processing method for printing substrates, which can effectively utilize laser and a drill bit to conveniently perform perforation processing with high accuracy and high efficiency but is not limited by the overlapping number of the substrates. In the method, after a process (S10) that periphery holes (2) for positioning and fixing are formed at predetermined positions of the periphery parts of the substrates (1) is carried out, a process (S20) that laser is adopted to process blind holes (5) in the substrates (1) at the set positions outside the periphery parts is carried out, and then after a process (S30) that each substrate (1) in which blind holes are processed is alternately superposed to form a workpiece (W) of a superposed body, lamination pins are inserted in the periphery holes (2) of the workpiece (W) of the superposed body, and each substrate is superposed and concentrated (workpiece (W)) is carried out, the process (S40) that a drill bit of which the diameter (expressing the diameter of a hole at the inlet side of the blind holes (5)) is larger than that of the blind holes (5) is adopted to perforate the workpiece (W) is carried out.

Description

technical field [0001] The present invention relates to a method of drilling holes in a printed wiring board (hereinafter referred to as "printed board") for drilling holes with high precision and efficiency. Background technique [0002] Now, when electrically connecting the conductive layers arranged on the front and back sides with an insulator sandwiched between the printed board, holes for connecting to the front and back conductive layers (hereinafter referred to as connection holes) are opened in the printed board, Conductive plating is applied to the inside of the connection hole to electrically connect the positive and negative conductive layers. With recent miniaturization and high-density mounting of electronic devices, the diameter of connection holes on printed circuit boards mounted on electronic devices has been in the size range of about 0.15 to 0.08 mm. Such connection holes are usually drilled or laser drilled. [0003] Figure 7 It is an explanatory diag...

AI Technical Summary

Problems solved by technology

If the surface roughness of the inner wall of the blind hole 5 is deteriorated as described above, the thickness of the plating layer formed in the electroplating process of the conductive plating layer will vary, thereby reducing the reliability of the electrical connection between the conductor layer 1a and the conductor layer 1b. reduce

[0018] In short, in conventional laser drilling, since it is necessary to strictly control the setting value of the energy intensity of the laser in order to maintain the processing accuracy of the hole, there is a problem that the drilling process cannot be performed conveniently.

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