Method for deplating sapphire plated layer by using waste polishing solution
A technology of waste polishing liquid and sapphire, which is applied in the field of glass surface treatment, can solve the problems of non-recyclable, complex components, environmental pollution, etc., and achieve the effect of ensuring crystal purity, good compactness and corrosion resistance, and improving economic benefits
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Embodiment 1
[0018] In this embodiment, it is mainly used to plate TiO on the surface 2 Deplating treatment of film sapphire
[0019] The waste polishing solution produced in the AG process described in this embodiment mainly includes hydrofluoric acid, sulfuric acid and ammonium fluoride.
[0020] Mix the waste polishing solution and water generated in the above AG process to form a mixed solution, so that the pH value is controlled below the pH value of 1. If the pH value is not within this range, water can be added to adjust it for the next step of deplating treatment ;
[0021] Plating TiO on the surface that needs to be stripped 2 The film sapphire is put into the above mixed solution and soaked at room temperature for deplating treatment for 35 seconds (s). After the deplating treatment is completed, it is rinsed with clean water to obtain the corresponding product.
[0022] The performance index of the stripped sapphire is tested, and the specific test results are as follows:
...
Embodiment 2
[0027] In this embodiment, it is mainly used to plate Ti on the surface 3 o 5 Deplating treatment of film sapphire
[0028] The waste polishing solution produced in the AG process described in this embodiment mainly includes hydrofluoric acid, sulfuric acid and ammonium fluoride.
[0029] Mix the waste polishing liquid and water generated in the above-mentioned AG process to form a mixed liquid, so that the pH value is controlled below the pH value of 1. If the pH value is not within this range, water can be added for adjustment, and the hydrogen in the mixed liquid The mass content of hydrofluoric acid is 45wt%, and is used for the next step of deplating treatment;
[0030] Plating Ti on the surface that needs to be stripped 3 o 5The film sapphire is put into the above mixed solution and soaked at 20°C for deplating treatment for 45 seconds (s). After the deplating treatment is completed, it is rinsed with clean water to obtain the corresponding product.
[0031] The per...
Embodiment 3
[0035] In this embodiment, it is mainly used for deplating treatment of Ti-coated sapphire on the surface
[0036] The waste polishing solution produced in the AG process described in this embodiment mainly includes hydrofluoric acid, sulfuric acid and ammonium fluoride.
[0037] Mix the waste polishing liquid and water generated in the above-mentioned AG process to form a mixed solution, so that the pH value is controlled below the pH value of 1. If the pH value is not within this range, water can be added for adjustment, and the hydrogen in the mixed solution The mass content of hydrofluoric acid is 40wt%, which is used for the next step of deplating treatment;
[0038] Put the Ti-coated sapphire on the surface that needs to be deplated into the above mixture and soak it at 28°C for 40 seconds (s) for deplating treatment. After the deplating treatment is completed, rinse it with clean water to obtain the corresponding product.
[0039] The performance index of the stripped ...
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