Cyanide-free alkaline copper plating solution and preparation method thereof

Abstract

The invention discloses cyanide-free alkaline copper plating solution, which consists of metal copper ions, a complexing agent and conducting salt. The complexing agent is 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide, and the content of the complexing agent is 200-300g / L; the conducting salt comprises potassium hydroxide and potassium carbonate, and the content of the conducting salt is 50-75g / L; the content of the metal copper ions is 8-12g / L; and during electroplating, the cathode-current density of a copper plating bath is 0.5-1.5A / dm<2>, the pH value of the plating solution is 9-10, and the temperature of the plating solution is 40-60 DEG C. The cyanide-free alkaline copper plating solution has the advantages of wide application temperature range, high current efficiency, fine plating layer crystals, good appearance and color, stable plating solution, strong levelling power and covering power, low cost and easy wastewater treatment, can replace hypertoxic cyanide copper plating solution, and is used for pre-plating copper or directly plating copper. The invention also relates to a method for preparing the cyanide-free alkaline copper plating solution.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a cyanide-free alkaline copper plating solution that can completely replace cyanide electroplating copper. The invention also relates to a preparation method of the cyanide-free alkaline copper plating solution. Background technique [0002] Electroplating plays an indispensable role in my country's national economy. Many industrial products require electroplating processing, and traditional decorative electroplating solutions must use highly toxic sodium cyanide, which has a huge impact on the environment and social stability. harm. [0003] Since the country promulgated the "Clean Production Promotion Law" and the State Council promulgated Order No. 32, electroplaters have done a lot of research on "eliminating outdated production processes of cyanide-containing electroplating". In recent years, the domestic cyanide-free alkaline copper plating process has been greatly ...

AI Technical Summary

Problems solved by technology

[0006] The two phosphorus of pyrophosphate are connected by oxygen. When the pH value is low, the pyrophosphate is easily hydrolyzed to produce orthophosphate and accumulate in the plating solution, so that the deposition rate is significantly reduced. And because many metals are in In the pyrophosphate plating solution, there will be a displacement reaction to produce a replacement copper layer, which will affect the bonding force between the plating layers, so pre-plating must be carried out before plating.

The cost of such a plating solution is high, the operating conditions are harsh, the plating solution is unstable, and waste solution treatment is difficult, etc., especially the poor bonding force of the plating layer hinders the popularization and application

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