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Solar silicon slice cleaning agent and method for preparing same

A technology for solar silicon wafers and cleaning agents, applied in detergent compounding agents, detergent compositions, chemical instruments and methods, etc., can solve the problems affecting device quality and yield, inappropriate solution concentration, black surface of silicon wafers, etc. To solve the problem, to achieve the effect of complete dissolving scale, cheap and easy-to-obtain chemicals, and strong ability to remove oil and stubborn scale

Active Publication Date: 2012-05-23
BEIJING UNIV OF TECH
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Problems solved by technology

[0002] In the process of industrial production, particles, metal contamination, organic contamination, natural oxide film, micro-roughness, etc. Affect the quality and yield of the device. At present, the main problems of the silicon wafer cleaning solution are the phenomena of blackening, bluishness, mottled, overoxidation, and inconsistent color on the surface of the silicon wafer after cleaning. These phenomena are mainly caused by the cleaning solution. The reagent ratio, temperature control, solution concentration and other factors caused by inappropriate

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  • Solar silicon slice cleaning agent and method for preparing same

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Embodiment Construction

[0015] 1. Cleaning solution preparation steps:

[0016] 1. Dissolve an appropriate amount of sodium hydroxide in deionized water to make an alkaline solution, then mix 1-5% sodium carbonate and 0.5-4% sodium silicate and dissolve them in the above-mentioned warm water to obtain a mixed solution.

[0017] 2. Add 0.1-1.5% chelating agent disodium ethylenediamine tetraacetate into the above mixed solution and stir evenly to prepare solution A.

[0018] 3. Add 0.1-4% of anionic surfactant sodium dodecylbenzene sulfonate, 0.4-2% dioctyl sodium sulfosuccinate, 0-1.5% of non-ionic surfactant polyethylene glycol, 0.1 ~2% of non-ionic surfactant Tween-80, 0.5-4% of non-ionic surfactant OP-10 were dissolved in deionized water and stirred evenly to prepare solution B.

[0019] 4. Mix 1-5% additive triethanolamine and 2-5% organic solvent absolute ethanol or n-butanol or isopropanol to prepare solution C.

[0020] 5. Dissolve solution B in solution C and mix well, then add the mixed sol...

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Abstract

The invention provides a solar silicon slice cleaning agent, and belongs to the field of cleaning agents for electronic industry. The cleaning agent of the invention mainly comprises sodium hydroxide, sodium carbonate, sodium silicate, disodium edentate, sodium dodecyl benzene sulfonate, sodium dioctyl sulfosuccinate, polyethylene glycol, Tween-80, OP-10, triethanolamine, anhydrous alcohol or normal butyl alcohol or isopropyl alcohol or a composition of anhydrous alcohol, normal butyl alcohol or isopropyl alcohol, and deionized water. The cleaning agent is alkaline, does not contain sulfur and phosphorus additives, and when used as alone, has the advantages of good decontamination and cleaning property, low slice-returning rate, long service cycle, no corrosion to silicon slice, low operational requirements in use, easy treatment of treated waste oil and sewage, and the suitability for manual, semi-automatic and full automatic ultrasonic cleaning production lines of various process; in addition, the cleaning rate is over 99 percent, the slice-returning rate is close to zero, and the cost of the process of the invention is one tenth to one twentieth of that of the conventional cleaning process.

Description

technical field [0001] The invention belongs to the technical field of surface cleaning for the electronic industry, and in particular relates to a cleaning agent which can be used for surface cleaning of photovoltaic solar silicon wafers and a preparation method thereof. Background technique [0002] In the process of industrial production, particles, metal contamination, organic contamination, natural oxide film, micro-roughness, etc. Affect the quality and yield of the device. At present, the main problems of the silicon wafer cleaning solution are the phenomena of blackening, bluishness, mottled, overoxidation, and inconsistent color on the surface of the silicon wafer after cleaning. These phenomena are mainly caused by the cleaning solution. The reagent ratio, temperature control, solution concentration and other factors are not suitable. Contents of the invention [0003] The object of the present invention is to provide a special water-based cleaning agent for sol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D1/83C11D3/20C11D3/30C11D3/04C11D3/60
Inventor 梅燕聂祚仁孙何
Owner BEIJING UNIV OF TECH
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