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Internal memory and storage device

A storage device and memory technology, applied in the direction of information storage, static memory, digital memory information, etc., can solve the problems of increased power loss, cost increase, incorrect output level, etc., to achieve the effect of increasing power loss and reducing component costs

Active Publication Date: 2012-12-12
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the bit line BL 1 May be due to the influence of the coupling capacitor, thus outputting an incorrect level (such as a low level)
In order to solve this problem, a known solution is to couple a pull-up load to the bit line, but this will increase the cost
In addition, the additional pull-up load will form a redundant current path (current path), thus increasing power loss

Method used

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  • Internal memory and storage device
  • Internal memory and storage device
  • Internal memory and storage device

Examples

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Embodiment Construction

[0017] In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the preferred embodiments are specifically listed below, together with the accompanying drawings, and are described in detail as follows:

[0018] figure 2 It is a schematic diagram of the storage device of the present invention. As shown in the figure, the storage device 200 includes a memory 210 and a reading circuit 230 . Memory 210 has a number of storage units (not shown in figure 2 ). The reading circuit 230 is used for reading data stored in the storage unit in the memory 210 . In a possible embodiment, the memory 210 is a read-only memory (Read-only memory; ROM).

[0019] The reading circuit 230 includes a switching unit 231 and a sensing unit 233 . The switching unit 231 is coupled between the memory 210 and the sensing unit 233 , and is used for selectively outputting the data stored in the storage unit in the memory 210 to the sensing un...

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PUM

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Abstract

The invention relates to an internal memory and a storage device. The internal memory comprises a plurality of word lines, a first bit line, a second bit line, a third bit line and a plurality of storage units, wherein the word lines are in parallel arrangement in turn; the first, second and third bit lines are perpendicular to the word lines and in parallel arrangement in turn; and each storage unit corresponds to a word line and a bit line. The word line corresponding to each storage unit corresponding to the first bit line is different from the word line corresponding to each storage unit corresponding to the second bit line. As the storage units are arranged in the internal memory in a staggered form, the noise interference (caused by coupling capacitance) of the adjacent bit line canbe avoided. In addition, the pullup load is not needed to add. Therefore, the cost of components can be reduced and the power loss of the internal memory can be not increased.

Description

technical field [0001] The present invention relates to a memory and storage device, in particular to an arrangement structure of storage units of a storage device. Background technique [0002] figure 1 It is a schematic diagram of the arrangement of known memory cells. As shown in the figure, when the word line WL is enabled, the memory cell C 0 ~C 3 The transistors within are turned on, therefore, the bit line BL 0 ~BL 3 Then the corresponding level can be output. exist figure 1 , when the storage unit C 0 ~C 3 All transistors within are turned on, except the bit line BL 1 is the output high level, other bit lines (such as BL 0 、BL 2 、BL 3 ) are output low level. [0003] However, the bit line BL 1 with adjacent bit lines (such as BL 0 and BL 2 ) There is a coupling capacitance between them. Therefore, the bit line BL 1 Due to the influence of the coupling capacitor, an incorrect level (such as a low level) may be output. To solve this problem, a known ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C11/21G11C11/40G11C7/06
Inventor 陈瑞隆
Owner VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
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