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Ultraphonic auxiliary micro-nano embossing forming device

A molding device and ultrasonic-assisted technology are applied in the field of nano-imprinting devices, which can solve the problems of easy destruction of micro-nano scales, and achieve the effect of improving filling efficiency and avoiding wasted time.

Inactive Publication Date: 2012-08-15
ZHEJIANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In addition, during the demoulding process of the micro-nano components, since the thermal expansion coefficient of the polymer is much larger than that of the mold, the polymer micro-nano components have a large thermal stress concentration after cooling, which leads to the characteristics of the micro-nano scale during demoulding. easily destroyed

Method used

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  • Ultraphonic auxiliary micro-nano embossing forming device
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Embodiment Construction

[0022] The present invention will be further described below in conjunction with drawings and embodiments.

[0023] like figure 1 and figure 2 As shown, the torque motor 1 of the ultrasonic-assisted micro-nano imprint molding device of the present invention is installed on the support frame 21, and two guide shafts 7 are arranged under the beam of the support frame 21, and the two ends of the slider 4 pass through the linear bearing 5 and the guide shaft 7. Connected, can make relative linear movement along guide shaft 7.

[0024] The slider 4 is fixedly connected to the ball screw nut 3, the ball screw 2 is connected to the output shaft of the torque motor 1 through a coupling, the ball screw nut 3 cooperates with the ball screw 2, and the rotation of the torque motor 1 passes through the ball screw The rod nut 3 and the ball screw 2 drive the slider 4 to move linearly up and down.

[0025] The bottom of the slider 4 is fixedly connected with the ultrasonic generator 6 , ...

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Abstract

The invention discloses an ultraphonic auxiliary micro-nano embossing forming device comprising a lower heating plate and an upper heating plate, wherein the lower heating plate and the upper heating plate are respectively used for placing a substrate and an embossing mould; the embossing mould acts on the substrate when the lower heating plate and the upper heating plate are mutually approached;one side of the upper heating plate, which is back on to the lower heating plate, is provided with an ultrasonic vibration generation device. Compared with the traditional embossing, the ultraphonic auxiliary micro-nano embossing molding device obviously improves the flow characteristics of a polymer by adopting ultrasonic vibration and a clamping cover and can reduce the cooling shrinkage heat stress to minimum, thereby enhancing the embossing quality of the polymer; and besides, the whole embossing process can be directly carried out in the air without carrying out vacuumizing treatment dueto the addition of ultrasonic waves, thereby not only simplifying the mechanical structure, but also saving the vacuumizing process and enhancing the embossing forming efficiency.

Description

technical field [0001] The invention relates to micro-nano imprinting technology, in particular to a nano-imprinting device which adds ultrasonic vibration and prevents uniform shrinkage. Background technique [0002] Since the polymer micro-nano imprint molding technology was proposed by StephenY Chou of Princeton University in the United States in 1995, it has become the main method for the processing of polymer micro-nano scale components due to its low cost and parallel processing. The typical process is mainly (1) the preparation of the mold, using optical etching technology, electron beam etching technology, etc. to process the micro / nano-scale structure on the stamp (mold). (2) In the imprinting process, put the mold and polymer into the imprinting device, heat it above the softening temperature of the polymer after vacuuming, pressurize to transfer the micro-nano structure on the mold to the surface of the polymer, and then hold the pressure After a period of time, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C59/02
Inventor 贺永傅建中章婷
Owner ZHEJIANG UNIV
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