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White LED light source package

A technology of LED light source and LED chip, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of uniform coating of phosphor layers and uneven output light, etc.

Inactive Publication Date: 2010-10-13
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The factors that affect the outgoing light are mainly the phosphor layer and its coating method. The traditional phosphor layer is coated in the form of dispensing. In this way, it is difficult to coat the phosphor layer uniformly. Therefore, the outgoing light uneven

Method used

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Embodiment Construction

[0012] The white LED light source package of the present invention is described in detail below in conjunction with the accompanying drawings: please refer to figure 1 As shown, the white LED light source package of the present invention includes a heat sink 8, an insulating substrate 1 bonded to the upper surface of the heat sink 8, a plurality of LED chips 2 bonded to the upper surface of the insulating substrate 1 and arranged in an array, and bonded to the insulating substrate 1. A number of reflective focusing cups 3 on the substrate 1 and surrounding each LED chip 2, an epoxy resin film 4 coated on the upper surface of the insulating substrate 1, and reflective cups coated on both sides of the epoxy resin film 4 The cup 5 , the phosphor layer 6 coated on the upper surface of the epoxy resin film 4 , and the glass 7 coated on the upper surface of the phosphor layer 6 , and the power supply are respectively connected to the electrodes at both ends of the LED chip 2 .

[00...

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Abstract

The invention provides a white LED light source package, which comprises a heat sink (8), an insulating substrate (1) bonded on the upper surface of the heat sink (8), an LED chip (2) bonded on the upper surface of the insulating substrate (1), a reflection spotlight cup (3) arranged around the LED chip, an epoxy resin layer (4) fixed on the upper surface of the insulating substrate (1), reflection cups (5) coated at both side surfaces of the epoxy resin layer (4), a fluorescent powder layer (6) coated on the upper surface of the epoxy resin layer (4), and glass (7) covering the upper surface of the fluorescent powder layer (6), wherein a power source is connected on an electrode of the LED chip (2), and the LED chip (2) array is arranged on the upper surface of the insulating substrate, so the emergent light of the white LED light source package is more uniform.

Description

technical field [0001] The invention relates to a light source package, in particular to a white LED light source package. Background technique [0002] LED (Lighting Emitting Diode) is a light-emitting diode, which is a semiconductor solid-state light-emitting device. At present, the concern about the global energy shortage is rising again. Therefore, saving energy is an important issue that we will face in the future. [0003] In the field of lighting, LEDs are widely used in various indications, displays, decorations, backlights, general lighting and urban night scenes due to their characteristics of energy saving, environmental protection, long life, and small size. Therefore, they attract the attention of the world. The LED manufacturing process is divided into chip manufacturing and packaging. Among them, the LED packaging process is a very important task. Otherwise, the LED light loss will be serious, the luminous flux and luminous efficiency will be low, the light c...

Claims

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Application Information

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IPC IPC(8): H01L25/13H01L33/48H01L33/50
Inventor 张方辉阎洪刚席俭飞蒋谦刘丁菡
Owner SHAANXI UNIV OF SCI & TECH
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