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Nonconductive adhesive composition and film and methods of making

An adhesive film, non-conductive technology, applied in the direction of adhesive type, film/sheet adhesive, adhesive, etc., can solve the problem of increased contact resistance

Inactive Publication Date: 2010-09-08
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when using this ACF, it was found that aging at 85°C and RH85% for 1000 hours resulted in an increase in contact resistance of 2Ω or more

Method used

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  • Nonconductive adhesive composition and film and methods of making
  • Nonconductive adhesive composition and film and methods of making
  • Nonconductive adhesive composition and film and methods of making

Examples

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example

[0069] Representative examples will be described in detail below, but it is clear to those skilled in the art that modifications and variations can be made to the following examples within the scope of the claims of the present application.

[0070] The materials used in this example are as follows:

[0071] A mixture of microencapsulated latent curing agent and thermosetting epoxy resin prepared by Asahi KaseiChemicals: HX3941HP (65% by weight epoxy resin, 35% by weight curing agent), HXA3042HP (66% by weight epoxy resin, 34% by weight curing agent %), HXA3922HP (67% by weight of epoxy resin, 33% by weight of curing agent), HXA3792 (65% by weight of epoxy resin, 35% by weight of curing agent) and HX3748 (65% by weight of epoxy resin, 35% by weight of curing agent) .

[0072] EXL2314 is a core-shell elastic fine particle with an acrylic rubber layer as the core and an acrylic resin as the shell, with a primary particle size of 100 to 600nm. Sale.

[0073] G402 is PLACCEL G...

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Abstract

To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 [mu]m or less, a film being formed by aggregation of the organic elastic fine particles, is provided.

Description

technical field [0001] The present invention relates to nonconductive adhesive compositions and nonconductive adhesive films, and to methods of making and using the same. More particularly, the present invention relates to: a non-conductive adhesive composition; a non-conductive adhesive film disposed between a flexible printed circuit board (FPC) and a circuit board and capable of being bonded to its conductor by thermocompression forming an electrical connection therebetween; and methods of making and using the same. Background technique [0002] For the electrical connection of the glass plate of the flat panel display to the flexible printed circuit board (FPC) and the electrical connection of the printed circuit board to the FPC, an anisotropic conductive film (ACF) has been used in the past. Generally, ACF contains a thermosetting resin and conductive particles. By sandwiching the ACF between such circuit boards or boards and thermocompression bonding them, the condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J7/00H01B5/16
CPCH05K3/361C08L51/06C08K9/10H05K2201/0212H05K2201/10977H05K3/305H05K2203/1189C09J163/00C08L2666/04C09J7/22C09J7/35C09J2301/304C09J2301/312C09J2301/412H01B5/16H05K1/141H05K1/142
Inventor 川手恒一郎有田纮子安井秀明佐藤义明
Owner 3M INNOVATIVE PROPERTIES CO
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