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Foot pad adjustment module and foot pad adjustment method

A technology for adjusting modules and foot pads, applied in the field of foot pads, can solve the problem of insufficient heat dissipation for electronic devices, and achieve the effect of improving heat dissipation efficiency and large heat dissipation space

Inactive Publication Date: 2010-08-25
PEGATRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in order to meet the needs of users, the operating performance of electronic devices has been continuously improved, and the waste heat generated has also increased accordingly. Therefore, the heat dissipation space formed by traditional foot pads will not be enough to provide the internal temperature of electronic devices. effective cooling

Method used

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  • Foot pad adjustment module and foot pad adjustment method
  • Foot pad adjustment module and foot pad adjustment method
  • Foot pad adjustment module and foot pad adjustment method

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Embodiment Construction

[0014] Please refer to FIG. 1 , which is a schematic diagram of a foot pad adjustment module. The foot pad adjustment module proposed by the present invention is applied to an electronic device 1 having a casing 2, and the electronic device 1 is suitable for placing on a plane 3 (refer to FIG. 2A or FIG. 2B ). Wherein, the electronic device 1 can be a notebook computer, a portable electronic device or other electronic devices with foot pads for heat dissipation. The foot pad adjustment module includes: an adjustable foot pad 10 , a temperature sensing unit 20 , a control unit 30 and a drive unit 40 .

[0015] The adjustable foot pad 10 is disposed in the housing 2 , and at least a part thereof protrudes from the housing 2 and contacts the plane 3 . Wherein, the part of the adjustable foot pad 10 protruding from the housing 2 can form a heat dissipation space between the electronic device 1 and the outside world with the plane 3 . In this way, the heat dissipation space gener...

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Abstract

The invention relates to a foot pad adjustment module and a foot pad adjustment method. The foot pad adjustment module is used in an electronic device with a shell, and the electronic device is suitable to be placed on a plane. The foot pad adjustment module comprises an adjustable foot pad, a temperature sensing unit, a control unit and drive unit, wherein the adjustable foot pad is arranged in the shell, at least part of the adjustable foot pad extrudes from the shell and contacts with the plane; the temperature sensing unit is used to detect the temperature of the electronic device; the control unit is coupled with the temperature sensing unit and generates control signals according to the temperature; and the drive unit is connected with the control unit and the adjustable foot pad, and the length of the part of the adjustable foot pad extruding from the shell can be adjusted according to the control signals.

Description

technical field [0001] The present invention relates to a foot pad applied to an electronic device, in particular to a foot pad adjustment module and an adjustment method thereof. Background technique [0002] Advances in technology have made people more dependent on various electronic devices, which means that people are exposed to many different types of electronic devices in their daily life. In addition, in the era of advanced information, people require electronic devices to have huge functions and must have fast computing capabilities. However, in the case that the electronic device operates at a high speed in order to improve performance, relatively more heat energy will be generated. When the waste heat causes the temperature to be too high, it may cause the electronic device to crash, or even destroy the components of the electronic device. Therefore, the heat dissipation of electronic devices has always been an important factor considered by designers or manufact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/20G06F1/20
Inventor 余士竞
Owner PEGATRON
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