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Method for preparing heat dipping tin of plastic sealed axial diode

A technology of axial diodes and diodes, applied in hot-dip plating process, semiconductor/solid-state device manufacturing, coating, etc., can solve the problems of time-consuming and labor-intensive, unfavorable for efficient assembly line production, etc., to improve processing speed, facilitate Flow operation, reliable positioning effect

Active Publication Date: 2010-07-07
SIYANG GRANDE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, only one electrode of the diode can be hot-dip tinned at a time with this jig. If you want to hot-dip tin both electrodes of the diode, you need to turn the diode over in turn to expose the untinned electrode, and then tinning
This method is time-consuming and labor-intensive, which is not conducive to efficient assembly line production

Method used

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  • Method for preparing heat dipping tin of plastic sealed axial diode
  • Method for preparing heat dipping tin of plastic sealed axial diode
  • Method for preparing heat dipping tin of plastic sealed axial diode

Examples

Experimental program
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Embodiment

[0033] Embodiment: the preparation method of the hot-dip tin of plastic-encapsulated axial diode, comprises the following steps:

[0034] (1) Before the hot-dip tin treatment is performed on the plastic-encapsulated axial diodes that require hot-dip tin treatment, they are firstly treated with degumming and drying, and the residual glue is removed with a degumming solution.

[0035] (2) Straighten the plastic-encapsulated axial diodes that have been processed before degumming and drying through the vibrating basin, the first discharge guide rail, the belt wheel, the chain and the straightening wheel, and then arrange them on the second discharge guide rail in sequence . Specifically: the plastic-encapsulated axial diode is first put into the vibrating basin, and then the diode is dropped into the chain from the vibrating basin through the first discharge guide rail and the belt wheel, and then the plastic-encapsulated axial diode dropped into the chain is guided straight throu...

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PUM

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Abstract

The invention discloses a method for preparing heat dipping tin of a plastic sealed axial diode, which comprises the following steps: placing the plastic sealed axial diode in an adapter plate; placing a first heat dipping tin positioning fixture below the adapter plate, ensuring that a lower substrate of the first heat dipping tin positioning fixture is tightly attached to a bottom plate of the adapter plate, and tightly clamping a first electrode of the diode by using the first heat dipping tin positioning fixture; removing the adapter plate, placing the first heat dipping tin positioning fixture in a guide rail of a tin dipping machine, and starting the tin dipping machine to perform dip soldering on a second electrode of the diode; tightly clamping the second electrode of the plastic sealed axial diode by a second heat dipping tin positioning fixture through the adapter plate; placing the second heat dipping tin positioning fixture in the guide rail of the tin dipping machine, and performing dip soldering on the first electrode of the diode; and finally, cleaning and drying the plastic sealed axial diode. The plastic sealed diode heat dipping tin positioning fixture with simple structure, convenient assembly and disassembly and reliable positioning is adopted, so that the processing speed of the heat dipping tin is improved, the material backlog of the procedure is reduced, and the production line is facilitated.

Description

technical field [0001] The invention relates to a method for preparing hot-dip tin for a plastic-encapsulated axial diode. Background technique [0002] At present, the plastic-encapsulated axial diodes are currently tinned by electroplating, but because the electrode material of the plastic-enclosed axial diodes is relatively soft, long-term stirring during the electroplating process will cause the material to bend, so the materials can only be manually removed one by one after tinning. However, this process consumes a lot of manpower, resulting in a large backlog of materials in the production line, which is not conducive to cost control. [0003] Therefore, people began to use the hot-dip tin process to perform chemical tin plating on the plastic-enclosed axial diode. This process neatly fixes the plastic-enclosed axial diode on the fixture, and then transports the tin solution through the guide rail to complete the tin plating. Due to the use of clamps to clamp and fix ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C2/08C23C2/34H01L21/60
Inventor 徐小红
Owner SIYANG GRANDE ELECTRONICS CO LTD
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