Semiconductor temperature difference power generation device

Abstract

The invention provides a semiconductor temperature difference power generation device which comprises a heat absorber, a heat radiator and a semiconductor power generation chip, wherein the heat absorber comprises a heat absorbing part and a heat transfer part, and the heat absorbing part is used for being in contact with a liquid heat source to absorb heat from the liquid heat source; the heat transfer part is used for conducting heat absorbed by the absorbing part; the heat radiator is positioned outside the liquid heat source and arranged on the heat transfer part of the heat absorber; the semiconductor power generation chip is positioned between the heat transfer part of the heat absorber and the heat radiator, the heat end of the semiconductor power generation chip is connected with the heat transfer part, and the cold end of the semiconductor power generation chip is connected with the heat radiator. The device stores a plurality of energy in the liquid by adopting high-temperature liquid as the heat source through the heat capacity of the high-temperature liquid to realize temperature difference power generation, thereby realizing continuous power generation.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of power generation, and in particular to a semiconductor thermoelectric power generation device. Background technique [0002] The semiconductor thermoelectric power generation technology utilizes the Seebeck effect to form a temperature difference between the hot end and the cold end of the semiconductor power generation chip, thereby generating electricity. In the prior art, there are various heat sources provided to the hot end of the semiconductor power generation chip, such as: burning candle flame, heat released during fuel combustion, and waste heat and waste heat generated in various waste heat systems (such as: automobile exhaust pipe The heat released, the waste heat discharged from the flue, etc.). [0003] There are at least the following problems in the prior art: the above-mentioned heat sources are heat sources that can continuously provide heat, that is, the heat sourc...

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Problems solved by technology

[0003] There are at least the following problems in the prior art: the above-mentioned heat sources are heat sources that can continuously provide heat, that is, the heat source needs to continuously replenish energy and consume fuel to maintain the heat supply, so that the hot end of the existing semiconductor power generation chip must be connected to the heat source. together and need to be constantly replenished with fuel or energy

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