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Electroplating method of integrated circuit lead frame

A lead frame and integrated circuit technology, which is applied in jewelry and other fields, can solve the problems of large waste of dry film, high cost, and high price of dry film, and achieve the effect of low electroplating cost, which is conducive to mass production and saves consumption

Active Publication Date: 2010-05-26
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroplating method (process diagram as shown in Figure 1) of prior art integrated circuit lead frame is: paste dry film; Exposure; Development; Electroplating; process steps to form an electroplating mask, but due to the high price of the dry film and the need to paste the dry film on the surface of the integrated circuit lead frame during the process, the dry film corresponding to the area to be electroplated is removed after exposure and development. Then the waste of dry film is large, so the cost of electroplating is very high, which is not conducive to the mass production of lead frames

Method used

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  • Electroplating method of integrated circuit lead frame
  • Electroplating method of integrated circuit lead frame
  • Electroplating method of integrated circuit lead frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A kind of electroplating method of integrated circuit lead frame as shown in Figure 2, it comprises the following steps:

[0026] ①. Make the screen printing plate 5 according to the lead frame, and engrave the screen printing plate 5 according to the conventional method;

[0027] ②. Dilute the photosensitive ink 6, the blending ratio of photosensitive ink 6 and diluent is 7:3, the photosensitive ink 6 is photosensitive green oil, photosensitive green oil and diluent are commercially available products, and the diluent is Hong Kong Sun The model produced by Taiyo ink international limited is CA-40 AUS303, and it only needs to be prepared according to the proportion after purchase;

[0028] ③. After the diluted photosensitive ink 6 is spread over the upper surface of the screen printing plate 5, as shown in Figure 2 (a), the lead frame 1 is double-sided printing plate, as shown in Figure 2 (b) on the lead frame 1 Partial areas of the upper and lower surfaces of the ink ...

Embodiment 2

[0036] A kind of electroplating method of integrated circuit lead frame as shown in Figure 2, it comprises the following steps:

[0037] ①. Make the screen printing plate according to the lead frame, and engrave the screen printing plate 5 according to the conventional method;

[0038] ②. Dilute the photosensitive ink 6, the blending ratio of photosensitive ink 6 and diluent is 7:3, the photosensitive ink 6 is photosensitive green oil, photosensitive green oil and diluent are commercially available products, and the diluent is Hong Kong Sun The model produced by Taiyo ink international limited is CA-40 AUS303, and it only needs to be prepared according to the proportion after purchase;

[0039] ③. After the diluted photosensitive ink 6 is spread over the upper surface of the screen printing plate 5, as shown in Figure 2 (a), the lead frame 1 is double-sided printing plate, as shown in Figure 2 (b) on the lead frame 1 Partial areas of the upper and lower surfaces of the ink fi...

Embodiment 3

[0047] A kind of electroplating method of integrated circuit lead frame as shown in Figure 2, it comprises the following steps:

[0048]①. Make the screen printing plate according to the lead frame, and engrave the screen printing plate 5 according to the conventional method;

[0049] ②. Dilute the photosensitive ink 6, the blending ratio of photosensitive ink 6 and diluent is 7:3, the photosensitive ink 6 is photosensitive green oil, photosensitive green oil and diluent are commercially available products, and the diluent is Hong Kong Sun The model produced by Taiyo ink international limited is CA-40AUS303, and it only needs to be prepared according to the proportion after purchase;

[0050] ③. After the diluted photosensitive ink 6 is spread over the upper surface of the screen printing plate 5, as shown in Figure 2 (a), the lead frame 1 is double-sided printing plate, as shown in Figure 2 (b) on the lead frame 1 Partial areas of the upper and lower surfaces of the ink film...

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Abstract

The invention discloses an electroplating method of an integrated circuit lead frame, which is characterized by comprising the following steps of: firstly, manufacturing a screen plate (5); secondly, diluting light sensing ink (6); thirdly, carrying out printing on a lead frame (1); fourthly, drying; fifthly; exposing; sixthly, developing; seventhly, electroplating a metal layer; eighthly, removing a film; and ninthly, cleaning and sunning. Compared with the prior art, the invention has the advantages that because steps that the light sensing ink and a screen plate technology are firstly used to carry out film coating on the lead frame and then exposing, developing and electroplating are carried out are adopted, the screen plate is printed only aiming to a special region so as to efficiently save the use level of the light sensing ink, the use level of the light sensing ink is obviously less than the that of dry film, and in addition, the price of the light sensing ink is obviously lower than the that of the dry film, therefore, the invention has low electroplating cost and is beneficial to batch production.

Description

Technical field: [0001] The invention relates to a method for manufacturing an integrated circuit lead frame, in particular to an electroplating method for an integrated circuit lead frame whose surface is partially electroplated. Background technique: [0002] Integrated circuit lead frames (such as QFN-quad flat no-lead package, QFP-four-side pin flat package, etc.) are the basic components for manufacturing integrated circuit semiconductor components. In order to meet the needs of manufacturing integrated circuit semiconductor components, the surface area of ​​the integrated circuit lead frame needs to be plated with metal silver or nickel palladium gold, and the rest of the part does not require plating, otherwise it cannot meet the needs of manufacturing integrated circuit semiconductor components, so the integrated circuit lead frame When performing electroplating, it is necessary to use an electroplating mask to protect the parts of the surface that do not need to be ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D7/00
Inventor 郑康定邓道斌马叶军
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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