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Semiconductor package and its manufacturing method

A manufacturing method and packaging technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of complex structure, unfavorable thinning of the package body, lack of freedom, etc., and achieve structural simple effect

Inactive Publication Date: 2010-03-31
FUJIKURA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of such a method, it is necessary to provide a groove in the cover, the reinforcement ring, or the insulating substrate to form a vent hole for realizing ventilation with the outside of the package, and there is a problem that the structure is complicated and the production takes a lot of time.
In addition, since the reinforcement ring is required, the size is fixed, and the degree of freedom in design cannot be obtained, which is not conducive to the thinning of the package.

Method used

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  • Semiconductor package and its manufacturing method
  • Semiconductor package and its manufacturing method
  • Semiconductor package and its manufacturing method

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Embodiment Construction

[0027] Hereinafter, the present invention will be described based on the best mode with reference to the drawings.

[0028] Figure 1A , B are cross-sectional view A and plan view B schematically showing an example of the semiconductor package of the present invention, Figure 1A means along Figure 1B A cross-section along line A-A is shown. In addition, in other embodiments described later, the same reference numerals are used for the same components as in this embodiment, and descriptions thereof are omitted, and they are the same unless otherwise specified.

[0029] Such as Figure 1A , B, the semiconductor package 10 in this embodiment at least includes: a body 11 having a device 12 on at least one surface; a protective member 14 arranged above the device 12; The wall portion 13 of the component 14 .

[0030] The device 11 is a base material provided with the device 12 on at least one surface, for example, a substrate formed of a semiconductor wafer such as silicon (Si)...

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Abstract

A semiconductor package is provided with a workpiece that is provided with a device at least on one side, a wall part provided in a manner spaced apart along the outer periphery of the device, and a cover member that is arranged in such a manner as to form a first space at the upper part of the device and supported by the workpiece through the wall part. The first space is provided with at least one or more second spaces communicating with an external space.

Description

technical field [0001] The present invention relates to a semiconductor package and a manufacturing method thereof, and more specifically, to a semiconductor package capable of eliminating the occurrence of dew condensation in a semiconductor package provided with a protection member for protecting a device, and to a manufacturing method thereof. [0002] This application is based on the priority of Japanese Patent Application No. 2007-188241 for which it applied to Japan on July 19, 2007, and uses the content here. Background technique [0003] In the work of forming a device, many packages are provided with a protective member to protect the device. For example, when a device with an image sensor such as a CCD is packaged, in order to protect the microlens located on the image area in the process environment and the use environment, a protective glass as a protective component is often provided to form a certain thickness on the device through an adhesive layer. Space. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L27/14
CPCH01L2924/0002H01L23/10H04N5/2253H01L31/0203H01L27/14618H01L2924/16195H04N23/54H01L2924/00H01L23/02H01L27/14
Inventor 平船纱耶佳末益龙夫
Owner FUJIKURA LTD
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