A semiconductor device package using discrete conductive layer to re-select bonding line path

Abstract

The invention discloses a semiconductor device package that uses discrete conductive layer to re-select bonding line path, which comprises a lead frame, wherein the lead frame comprises a chip bonding pad and a plurality of pins that coupled to the first chip bonding pad; a vertical semiconductor device is bonded to the chip bonding pad; the vertical semiconductor device is provided with a conductive gasket; the conductive gasket is connected with a pin through the first bonding line; an electricity isolated conductive wire is formed on a conductive material layer of the first semiconductor device; the conductive wire provides a conductive path between the first bonding line and the second bonding line; or, the conductive path is set under the third bonding line to conduct, so as to avoidintercross between the third bonding line and other bonding lines, or the conductive path makes length of the first and the second bonding line shorter than the maximum preset length.

Description

technical field [0001] The present invention relates to semiconductor device packaging and, in particular, to avoiding problems associated with wire bonding in semiconductor device packaging. Background technique [0002] Semiconductor devices are typically packaged on die pads of lead frames. The lead frame provides pins to make electrical connections between the device package and other components of the device or system. The electrical connection from the leads of the lead frame to the conductive substrate of the semiconductor device is achieved by bonding wires. There are a number of rules that affect the selection of bond wire paths. One of the rules is that two bond wires cannot cross. Another rule is that the bond wire must be shorter than a predetermined maximum length. In general, the maximum length of the bonding wire is 200-300mils. These rules create problems when a semiconductor device package manufactured by one manufacturer uses semiconductor device compo...

AI Technical Summary

Problems solved by technology

And customers are generally reluctant to buy parts with non-standard pinouts

Additionally, the manufacturer of packaged assembly 100 may need to use specific control IC 102 and DP output

In this case, Figure 2A-2B Alternatives to the types shown may not be realistic

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