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LED packager

A technology of light-emitting diodes and diodes, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve problems such as light loss, and achieve the effect of improving luminous efficiency

Active Publication Date: 2011-06-01
TEKNOWLEDGE DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] by 1A shows that in the known LED package 100, the rear surface of the LED chip 120 will be bonded to the circuit board 110, and part of the light emitted by the LED chip 120 will go to the circuit board 110. These light rays usually need to go through multiple reflections before they can leave the interior of the LED chip 120. In the process of various light rays being reflected, a large amount of light loss is unavoidable.
Therefore, there is still room for improvement in the luminous efficiency of the known LED package 100

Method used

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Examples

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no. 1 example

[0044] Figure 2A is a side view of the LED package according to the first embodiment of the present invention, and Figure 2B It is a three-dimensional schematic view of the LED package according to the first embodiment of the present invention. Please refer to Figure 2A and Figure 2B , the light emitting diode package 200 of this embodiment includes a carrier 210 , a light emitting diode chip 220 and a plurality of conductors 230 . The light emitting diode chip 220 has a front side 220a, a back side 220b and a plurality of sidewalls 220c connected between the front side 220a and the back side 220b, and one of the sidewalls 220c of the light emitting diode chip 220 faces the carrier 210 and is connected to the carrier 210 . In addition, the conductor 230 is electrically connected between the carrier 210 and the LED chip 220 .

[0045] In this embodiment, the carrier 210 can be a circuit board with a plurality of pads 212 , and the LED chip 220 is electrically connected...

no. 2 example

[0053] image 3 It is a side view of the LED package according to the second embodiment of the present invention. Please refer to image 3 The light emitting diode package 300 of this embodiment is similar to the light emitting diode package 200 of the first embodiment, but the main difference between the two lies in: the light emitting diode chip 320 and the light emitting diode chip 220 used in this embodiment. In detail, the LED chip 320 has a plurality of electrodes 322, 324, and these electrodes 322, 324 are distributed on the front side 320a and the back side 320b of the LED chip 320 respectively. In addition, the electrodes 322 and 324 are respectively electrically connected to the carrier 210 through the conductors 230 located on both sides of the LED chip 320 .

no. 3 example

[0055] Figure 4 It is a side view of the LED package according to the third embodiment of the present invention. Please refer to Figure 4 The light emitting diode package 400 of this embodiment is similar to the light emitting diode package 300 of the second embodiment, but the main difference between the two is that the number of light emitting diode chips 320 used in this embodiment is multiple ( Figure 4 are shown as 3). In detail, since the LED chips 320 are connected to the carrier 210 through the sidewalls 320c, the distance between the LED chips 320 (the distance from the center to the center of the two LED chips 320) can be effectively shortened, with good performance. light mixing efficiency. In other words, on the carrier 210 with the same area, this embodiment can accommodate a larger number of LED chips 320 to easily meet the requirement of high brightness output.

[0056] It is worth noting that in this embodiment, optical elements (such as light guide elem...

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Abstract

The invention discloses an LED packager comprising a carrier, an LED chip and a plurality of conductors, wherein the LED chip is provided with a front surface, a back surface and a plurality of side walls connected between the front surface and the back surface; one side wall of the LED chip faces the carrier and is connected with the carrier; and the conductors are electrically connected betweenthe carrier and the LED chip.

Description

technical field [0001] The present invention relates to a light-emitting diode package (light-emitting diode package, LEDpackage), and in particular to a light-emitting diode package with good luminous efficiency. Background technique [0002] Light-emitting diodes (LEDs) are semiconductor components, and their materials mainly use III-V chemical elements, such as compound semiconductors such as gallium phosphide (GaP) and gallium arsenide (GaAs). It is to apply current to the compound semiconductor, and through the combination of electrons and holes, the excess energy is released in the form of light to achieve the effect of luminescence. Since the light-emitting phenomenon of the light-emitting diode is not through heating or discharging, the life of the light-emitting diode is as long as more than 100,000 hours, and there is no need for idling time. In addition, LEDs are more responsive (approximately 10 -9 Seconds), small size, low power consumption, low pollution, hig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L25/075H01L23/488
CPCH01L2224/48091
Inventor 黄崇仁陈吉元卢叔东
Owner TEKNOWLEDGE DEV
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