Bearing plate for wave-soldering device

Abstract

The invention relates to a bearing plate for a wave-soldering device, which is used for bearing a circuit board provided with plug-in components. The bearing plate is provided with a plurality of openings corresponding to the plug-in components, one side close to the openings on the bearing plate is provided with a drip flake structure which passes through one side of the wave-soldering device on the bearing plate, the drip flake structure comprises a fixed part and a metal layer which is arranged on the surface of the fixed part and has drip flake property, and during soldering, the drip flake structure absorbs the redundant soldering tin from the adjacent side of soldering pins of the plug-in components during soldering so as to avoid bad phenomena of tin bridges and the like appearing among the soldering pins.

Description

technical field [0001] The invention relates to a bearing technology applied to wave soldering equipment, in particular to a bearing plate used to absorb excess solder during welding. Background technique [0002] With the advancement of industrial technology, the components on the circuit board are becoming smaller and smaller, so that the spacing of the soldering points is also changed from a large spacing to a small spacing. Especially for some components with multiple soldering feet, such as chips, etc., the number of soldering feet is relatively large and dense, and the distance between the soldering feet is measured in mils, so the distance between each other is equivalent. Therefore, in actual soldering, the problem that multiple soldering pins are easily bonded by solder often occurs. [0003] Generally, when soldering such densely spaced electronic components, wave soldering equipment is used to complete the soldering spot welding. In detail, the wave soldering equ...

AI Technical Summary

Problems solved by technology

Therefore, it is not only time-consuming, but also cumbersome and repetitive, which reduces work efficiency, and is prone to omissions, resulting in the outflow of defective products, which may damage the company's industrial interests. Therefore, this phenomenon is actually a problem that affects production quality and production efficiency.

[0005] In order to improve the above defects, some solutions have been adopted in the industry, such as adding deflector fins on the back side of the pads of the circuit board, so that excess solder can flow toward the deflector fins to avoid flowing toward adjacent soldering points , and then solve the phenomenon of solder bridges, but if it is necessary to set diversion grooves on each pad side of each circuit board, it will not only consume time and labor, but also cause relatively cost, so it is not conducive to use

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