High-hydrophobic material based on surface nano array structure and preparation method thereof

A high-hydrophobicity, nano-array technology, applied in electrolytic coatings, electrophoretic plating, coatings, etc., can solve problems such as high cost, difficult industrialization, and complex processes

Inactive Publication Date: 2009-12-16
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods generally have the following problems: (1) a large number of organic or inorganic reaction precursors are required, the process is complicated, the cost is high, and it is difficult to industrialize; (2) only using the hydrophobicity of the material itself does not imitate the lotus leaf. Surface uneven structure factors, the inevitable hydrophobic effect will not be very high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] (1) Degreasing and pickling treatment is performed on the surface of the copper sheet that needs to be hydrophobically treated.

[0031] (2) Place the metal substrate processed in step (1) in the electroplating solution, the metal substrate is used as the cathode, and the nickel plate is used as the anode, and the two, the power supply, and the electroplating solution are used to form a circuit through wires. The composition of the electroplating solution is: 0.1 mol / L of nickel chloride, 0.1 mol / L of triammonium citrate, 0.1 mol / L of boric acid, 1 ppm of crystal regulator copper chloride, solution temperature of 60° C., pH=6.

[0032] (3) Adjust the current density to 1A / min, electroplating for 20min

[0033] (4) Place the metal substrate treated in step (3) in the electrophoretic solution, the metal substrate is used as the cathode, and the nickel plate is used as the anode, and the two, the power supply, and the electrophoretic solution are used to form a circuit thr...

Embodiment 2

[0037] (1) Degreasing and pickling treatment is performed on the surface of the copper sheet that needs to be hydrophobically treated.

[0038] (2) Place the metal substrate processed in step (1) in the electroplating solution, the metal substrate is used as the cathode, and the nickel plate is used as the anode, and the two, the power supply, and the electroplating solution are used to form a circuit through wires. The composition of the electroplating solution is: nickel chloride 2.5 mol / L, triammonium citrate 2 mol / L, boric acid 1.0 mol / L, crystal regulator copper chloride 1000 ppm, solution temperature 25°C, pH=3.5.

[0039] (3) Adjust current density to 10A / min, electroplating for 2min

[0040] (4) Place the metal substrate treated in step (3) in the electrophoretic solution, the metal substrate is used as the cathode, and the nickel plate is used as the anode, and the two, the power supply, and the electrophoretic solution are used to form a circuit through wires. The e...

Embodiment 3

[0044] (1) Degreasing and pickling treatment is performed on the surface of the copper sheet that needs to be hydrophobically treated.

[0045] (2) Place the metal substrate processed in step (1) in the electroplating solution, the metal substrate is used as the cathode, and the nickel plate is used as the anode, and the two, the power supply, and the electroplating solution are used to form a circuit through wires. The composition of the electroplating solution is: 1 mol / L of nickel chloride, 1.0 mol / L of triammonium citrate, 0.5 mol / L of boric acid, 100 ppm of crystal regulator copper chloride, the temperature of the solution is 40° C., and the pH=4.5.

[0046] (3) Adjust the current density to 5A / min, and electroplating for 4 minutes.

[0047] (4) Place the metal substrate treated in step (3) in the electrophoretic solution, the metal substrate is used as the cathode, and the nickel plate is used as the anode, and the two, the power supply, and the electrophoretic solution ...

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Abstract

The invention relates to a high- hydrophobic material based on a surface nano array structure and a preparation method thereof, belonging to the technical field of a nano material; the high- hydrophobic material comprises a nano needle array and a hydrophobic film; wherein the hydrophobic film is adhered on the surface of the nano needle array; the nano needle array comprises a plurality of nano needles which grow longitudinally, and are vertical to a metal base material and arranged compactly. Proved by hydrophobic experiment, the contact angle of the high- hydrophobic material is higher than that of the common hydrophobic material by 50%.

Description

technical field [0001] The invention relates to a material in the field of nanotechnology and a preparation method thereof, in particular to a highly hydrophobic material based on a surface nano-array structure and a preparation method thereof. Background technique [0002] At present, many car skeletons and building outer walls are made of metal, but a big disadvantage of metal is that it is easy to corrode and easy to be contaminated with dust. According to statistics, the annual corrosion rate of existing metal equipment in the world is about 10%. Corrosion is largely caused by water on the metal surface. In order to solve this problem, a good way is to make the metal surface hydrophobic, which means that the metal surface does not stick to rainwater, so that corrosion is not easy to occur. In nature, one of the objects with excellent hydrophobic properties is the lotus leaf. The study found that the lotus leaf has a very superior hydrophobicity, and its mechanism is m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D13/00
Inventor 郭炜申筱濛吴洁晨孙怡婧张一木李明
Owner SHANGHAI JIAO TONG UNIV
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