Wafer fixing device and wafer fixing method

Abstract

The invention discloses a wafer fixing device and a wafer fixing method, which are used for solving the problems of twisted crystal grain arrangement, poor wafer flatness and poor space usage rate in the prior art. The wafer fixing device comprises a vacuum source, an adsorption device and a wafer fixing ring, wherein a first through hole is formed in the adsorption device, and the first through hole is connected to the vacuum source; the wafer fixing ring is arranged on the adsorption device and is fixed on the adsorption device through a clamping device; and the wafer fixing ring comprises an inner ring, an outer ring and an annular base, wherein the inner ring and the outer ring are formed on the annular base, an adsorption space is formed between the inner ring and the outer ring, and the annular base comprises a second through hole which is used for connecting the first through hole and the adsorption space. The wafer fixing method comprises the following steps: preparing the adsorption device; putting the wafer fixing ring on the adsorption device, and then, clamping the wafer fixing ring and the adsorption device through the clamping device; forming a vacuum state in the wafer fixing ring and the adsorption device; and putting a blue film pasted with a wafer on the wafer fixing ring.

Description

technical field [0001] The invention relates to a wafer fixing device, in particular to a wafer fixing device utilizing vacuum adsorption and a method thereof. Background technique [0002] Light emitting diodes (Light emitting diodes, LEDs) are becoming more and more widely used. At present, multiple light emitting diodes are arranged in arrays to present applications of light sources or displays; and on the wafer of the same light emitting diode, the color between the grains The wavelength and brightness are different. In order to meet the consistency of the product's requirements for color wavelength and brightness sensitivity, it is necessary to perform a crystal-picking process on the LED grains in the process steps. Before the die-picking process step, the LED wafer needs to be adhered to the blue film to fix the die when the wafer is divided into die. Afterwards, it is necessary to expand the blue film and use the expansion ring to be fixed on the edge of the blue f...

AI Technical Summary

Problems solved by technology

However, the structure of the loading table in US 6,803,780 is a solid structure. The loading table is only used to carry and fix the semiconductor wafer, and it is impossible to install test components under the wafer. If it is used in the process of light-emitting diodes, it cannot be placed on the loading table The thimbler is placed in the middle to sort the die, so its space utilization is limited, and it is impossible to install test components under the wafer during the wafer process flow, which reduces the flexibility of the process design.

[0005]Therefore, there is still a need for a device or system that can solve the above-mentioned distorted grain arrangement, poor wafer flatness and poor space utilization, so as to improve Production pass rate

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