Heat radiation die set and radiation system applying phase change metal thermal interface foil
A heat dissipation module and heat dissipation system technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problem of affecting the service life and reliability of electronic components, deteriorating the performance of microelectronic components, and damaging microelectronic components and other issues, to achieve the effects of low cost, avoiding liquid phase leakage, and simple process
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[0046] Please also refer to Figure 3A and Figure 3B , which are respectively a schematic diagram of the heat dissipation module and a schematic diagram of the bottom surface of the radiator of the present invention. The heat dissipation module 30 of the present invention can quickly transfer the heat generated by an electronic component 32 to the external environment. The heat dissipation module 30 includes a heat sink 31 and a phase-change metal thermal interface material (TIM) 34 .
[0047] The heat sink 31 is disposed above the electronic component 32 , and the bottom surface 311 of the heat sink 31 has at least one groove 312 . The phase change metal thermal interface foil 34 is disposed between the electronic component 32 and the bottom surface 311 of the heat sink 31 as a thermal interface material between the electronic component 32 and the heat sink 31 . Two sides of the phase-change metal thermal interface foil 34 are respectively in contact with the bottom surface...
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