A laser marking method on wafer surface

Abstract

A laser marking method on wafer surface includes: production of marking films, wherein, the matrix for marking films is glass sheets capable of permeating the laser, a metallic film layer with a certain thickness is formed on the single side surface of the glass sheet, the laser irradiates on the metallic film layer, and is blocked and accumulated by the metallic film layer, the thickness of the metallic film layer can ensure that the metallic film layer can be melted through by the laser irradiated by the laser marking machine; jointing of the marking film and the wafer surface, so that the metallic film layer surface on the marking film are jointed together with the position on the wafer surface required to mark; laser marking, using laser marking machine to irradiate laser to the position of the wafer required to mark from one side of the marking film without metallic film layer, the irradiated laser is blocked by the metallic film layer and accumulated at the metallic film layer, the accumulated laser can melt through the metallic film layer to ablate the wafer surface, for forming making on the wafer surface. So that three-dimensional effect makings can expediently be marked at wafer surfaces with various characteristics.

Description

technical field [0001] The invention relates to a marking method on the surface of an object by using a laser, in particular to a marking method on a wafer surface by using a laser. Background technique [0002] On some glass sheets, such as the surface of wafers such as mobile phone or camera filter, sometimes they need to be marked. There are mainly two methods for marking on the wafer, one is to paste a paper mark on the surface of the wafer, and the other is to use a laser to ablate a three-dimensional mark on the surface of the wafer. Paper marks have been phased out due to their short service life and great impact on the light transmission effect of the chip; while the method of marking on the surface of the chip with a laser has basically the same life as the chip and is not easy to be damaged. be widely applied. [0003] Under the existing technical conditions, when using a laser to mark the surface of a wafer, the required equipment is a laser marking machine and ...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned defects, the technical problem to be solved in the present invention is to provide a laser marking method on the surface of a wafer, which can be used to easily mark any type of wafer surface, and solve the problem of reflective laser wafers and completely laser marking methods. Wafer Surface Marking Problems by Laser