Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin

Abstract

The invention discloses a method for adopting a double head pressure contact pin to produce a multi-layer plate for a multi-layer dead hole. A backboard is divided into a plurality of sub-plates. When the sub-plates is produced by hole drilling, galvanization, surface treatment and other procedures, the double head pressure contact pin is used for pressing and being connected with an upper sub-plate and a lower sub-plate for purpose of lamination and press so as to finally form a motherboard. The holes at corresponding positions of the upper sub-plate and the lower sub-plate can together form an integral through hole though the double head pressure contact pin. The other holes in which no contact pins are inserted are dead holes. The pressed plates can be used directly without wet treatment. The invention can improve the contraposition, drilling and galvanization of the high multi-layer backboard, solves the problem on the protection of mechanical dead holes, optimizes the backboard production procedures, improves the productivity and reduces the product scrap rate.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit, in particular to a method for manufacturing a high-multi-layer blind-hole multilayer board by means of double-ended crimping pins. Background technique [0002] When making high-layer and high-thickness PCB backplanes, due to the large number of layers and high thickness of the board, the alignment between layers during lamination is a very big challenge. At the same time, when making through-holes after pressing, due to the large thickness-to-diameter ratio of the plate, the difficulty of drilling and electroplating increases: the increase of hole depth makes it difficult to remove chips during drilling, and the quality of the hole wall is poor; The smooth flow in the hole leads to a decrease in the electroplating efficiency; however, it is difficult to process the blind hole, and the residual liquid medicine in the blind hole cannot be cleaned, resulting in oxidation of the board ...

AI Technical Summary

Problems solved by technology

[0002] When making PCB high-layer and high-thickness backplanes, due to the number of layers and high thickness of the board, the alignment between layers during lamination is a very big challenge

At the same time, when the through hole is made after pressing, due to the large thickness-to-aperture ratio, the difficulty of drilling and electroplating increases: the increase in hole depth makes it difficult to remove chips during drilling, and the quality of the hole wall is poor; at the same time, the electroplating solution cannot The smooth circulation in the hole leads to a decrease in the plating efficiency; while the blind hole is difficult to process, the residual liquid in the blind hole cannot be cleaned, resulting in oxidation on the board surface and inside the hole

Summarizing the above reasons, when the thickness-to-aperture ratio of the PCB high-layer backplane exceeds a certain limit value, the process of making through holes is complicated and difficult to realize.

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