Wafer retaining system and semiconductor processing apparatus applying the system

Abstract

The invention discloses a crystal clamping device which is applied to fixing a semiconductor device to be processed / disposed in the process of semiconductor processing / disposing, comprising a clamping tool, a movable basic ring arranged around the clamping tool and a focusing ring arranged above the movable basic ring and around the clamping tool. The crystal clamping tool is further provided with a lifting regulating component composed of a first regulating part and a second regulating part, the first regulating part and the second regulating part coordinate with each other, so that the movable basic ring can continuously move upwards and downwards relative to the clamping tool to drive the focusing ring to continuously move upwards and downwards, as a result, the distance between the upper surface of the focusing ring and the upper surface of the clamping tool can be continuously adjusted. In addition, the invention also provides a semiconductor processing device applied to the crystal clamping system. The crystal clamping system and the semiconductor processing device of the invention can carry out continuous and accurate adjustment of the distance between the upper surface of the focusing ring and the upper surface of the clamping tool, thus improving product yield, moreover, the invention facilitates processing.

Description

technical field [0001] The present invention relates to the technical field of microelectronics, and more particularly, to a wafer clamping system for semiconductor processing / handling process. In addition, the present invention also relates to a semiconductor processing equipment using the wafer clamping system. Background technique [0002] In the integrated circuit (IC) manufacturing process, especially in the plasma etching (ETCH), physical vapor deposition (PVD), chemical vapor deposition (CVD) and other processes, in order to fix, support and transfer the wafer (Wafer) etc. To process the device, to avoid movement or dislocation of the processed device, a wafer clamping device such as an Electro Static Chuck (ESC for short) or a mechanical clamp is often used. [0003] Among them, electrostatic chucks use electrostatic attraction to fix processed devices such as wafers, which can be divided into two types: Coulomb and Johnson-Rahbek. Since the electrostatic chuck use...

AI Technical Summary

Problems solved by technology

[0011] Yet in actual application, there is such defective in above-mentioned dry cleaning technology: one, need to implement above-mentioned dry cleaning process additionally outside actual technological process, thus reduced the production efficiency of system; During the process, the oxygen introduced into the reaction chamber will not only react with the aforementioned polymer to remove it, but also attack the parts in the reaction chamber (for example, the upper surface of the more expensive electrostatic chuck will be damaged during the dry process). are exposed to oxygen attack during cleaning), thereby reducing the service life of these parts

However, in a typical electrostatic chuck system, the vertical gap between the focus ring and the wafer is small, and a step change in the height of the base ring will make the vertical gap between the focus ring and the wafer less controllable

[0016] Second, if the height of the base ring is to be adjusted in a small amount, it is necessary to set the variation of the step height of the stationary ring to be small, which will make processing difficult and lead to an increase in cost

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