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Wafer and method for verifying and defect and scanning machine

A defect scanning and wafer technology, applied in the direction of optical testing defects/defects, etc., can solve the problems of difficult frequent use, high cost of standard chips, etc.

Active Publication Date: 2009-06-10
FOUNDER MICROELECTRONICS INT
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiment of the present invention is to provide a method for verifying the defect scanning machine, in order to solve the problem that the cost of the standard sheet is high and it is not easy to use frequently

Method used

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  • Wafer and method for verifying and defect and scanning machine

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Embodiment Construction

[0012] In order to solve the problem that the cost of standard chips is high and it is not easy to use frequently, the embodiment of the present invention provides a method for verifying defect scanning machines and wafers. The method is to self-made and regularly test QC chips without using standard chips. , to verify the machine. The embodiment of the present invention adopts the following method. Before the test, use a standard chip to verify the accuracy of the machine, and then select a suitable QC chip, scan it on the machine, and record the particle distribution, particle size, and quantity. In order to fix the existing particles of the QC wafer, a layer of SiN film is grown on the surface of the QC wafer, so that the original particles on the surface of the QC wafer are wrapped by the SiN film and will not change with time. The QC wafer covered with SiN film is re-measured on the machine. At this time, the distribution, size and quantity of the particles are the param...

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Abstract

The invention discloses a method of validating defect scanning machines, in order to solve the problems of high cost of standard films, not frequent use. The disclosed method comprises: on the defect scanning machines after being validated by standard films, recording particle parameters on periodic test wafers as standard particle parameters, wherein granulometric periodic test wafers are arranged on the body surface of the scanning wafers; in the later daily monitoring of the defect scanning machines, scanning the periodic test wafers on the defect scanning machines, recording the particle parameters; comparing the difference of the particle parameters and the standard parameters recorded in daily monitoring, if in the given threshold range, the defect scanning machines is validated to be eligible, otherwise ineligible. Due to the self-made periodic test wafers, frequent use of the standard wafers is avoided.

Description

technical field [0001] The invention belongs to the field of semiconductors, in particular to a wafer and a method for verifying a defect scanning machine. Background technique [0002] The particles on the wafer are scanned on the defect scanning machine, and the parameters of the particles on the wafer can be determined. In order to verify the accuracy and stability of the defect scanning machine, the stability and accuracy of the machine need to be verified regularly. The existing technology is to use standard chips of different specifications to periodically verify the machine (such as a test every month), and each standard chip has corresponding particle parameters, that is, the size and the number of particles. Explain, for example, there are 30,000 0.6um particles on one standard sheet, and 31,000 0.9um particles on another standard sheet. When verifying the machine, use standard chips of various specifications to test the machine, and record the test results, compar...

Claims

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Application Information

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IPC IPC(8): G01N21/93
Inventor 张维怡黄文亮王湛
Owner FOUNDER MICROELECTRONICS INT
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