Plasma confinement apparatus and semiconductor processing equipment applying the same

Abstract

The invention provides a plasma constraint device for limiting plasma diffusion. The constraint device comprises at least one layer of cylindrical constraint cover, wherein each layer of the constraint cover is provided with a through hole so as to form a constraint passage. The invention also provides semiconductor processing equipment applying to the plasma constraint device, which comprises a reaction cavity, an upper electrode, a lower electrode and the plasma constraint device, wherein the constraint device is positioned in the reaction cavity and encircles the reaction zone between the upper electrode and the lower electrode so as to prevent the plasma from diffusing outside the constraint device. The plasma constraint device and the semiconductor processing equipment are convenient for mounting and maintenance and uneasy to destroy. Meanwhile, the plasma constraint device and the semiconductor processing equipment can reduce and even avoid particle pollution caused by the plasma outside the reaction zone, so as to increase product yield and prolong service life of parts in the reaction cavity.

Description

technical field [0001] The present invention relates to the technical field of microelectronics, in particular, to a plasma confinement device used in semiconductor processing / processing technology and semiconductor processing equipment using the confinement device. Background technique [0002] With the rapid development of electronic technology, people's requirements for the integration of integrated circuits are getting higher and higher, which prompts companies that produce integrated circuits to continuously improve the processing / processing capabilities of semiconductor devices. In the processing / processing of semiconductor devices, semiconductor processing / processing equipment such as plasma processing apparatuses are widely used. [0003] Currently, existing plasma processing devices generally include various parts such as a reaction chamber, an upper / lower electrode, a gas input part, and a vacuum obtaining part. In the actual process, the working process of the pl...

AI Technical Summary

Problems solved by technology

Therefore, the installation and positioning of the plasma confinement ring set provided by the prior art is relatively complicated, and the mechanical connection between adjacent confinement rings is also relatively complicated, which leads to complicated installation and maintenance of the plasma confinement ring set, time consuming

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