Electric connection structure of circuit board and circuit board with the same

Abstract

The present invention discloses a electronic connection structure of circuit board and a circuit board thereof, which comprises the following procedures: connecting power contact and grounding contact of electronic component to power plane and ground plane of circuit board separately; electronic connection structure comprises the first conductive structure and the second conductive structure, one end of both conductive structure is conductive contact segment, two conductive contact segments electronically connect with power contact and ground separately, the other end of each conductive structure extends from its conductive contact segment to form a plurality of dual segments, the two dual segments of the two conductive structure are pair configuration. The pairing dual segments of the two conductive structures deploy in the way of interleaved array to form loop with two current in opposite direction. Magnetic flux is counteracted mutually to make situation that impedance of decoupling capacitor in electronic circuit power supply system adds along with the rise of electronic component switching frequency eases up.

Description

technical field [0001] The present invention relates to an electrical communication structure of a circuit board, in particular to a metal communication structure arranged in the circuit board for electrically connecting the contacts of the electronic components on the circuit board to the power supply layer and the grounding layer of the circuit board. structure, this circuit board can be a circuit board with embedded capacitors. Background technique [0002] Electronic components are often arranged on a printed circuit board (Printed Circuit Board) or an integrated circuit substrate (IC substrate) (the circuit board is used as an example below, but not limited to the circuit board). The metal connection structure in the circuit board is electrically connected to the power plane (Power plane, also known as the power plane) and the ground plane (Ground plane, also known as the ground plane) in the circuit board, so that the electronic component can receive power from the cir...

AI Technical Summary

Problems solved by technology

Although this patent can properly reduce the equivalent series inductance, the equivalent series inductance 128 at the metal connection structure marked in the figure cannot be effectively reduced

[0006] In the power supply system of electronic circuits, in addition to the plate capacitor embedded in the circuit board, the capacitor type with decoupling effect also adopts the surface mount component (SMD, Surface Mount Device) capacitor. However, due to the embedded plate capacitor ratio Surface mount (SMD) capacitors soldered on the surface of printed circuit boards or IC substrates are closer to the power and ground pins of electronic components, so that the parasitic inductance generated by the power transmission path of embedded capacitors at high frequencies is higher than that generated by SMD capacitors The parasitic inductance value is low, that is, the decoupling effect of the embedded plate capacitor is better, but the plate capacitor is the same as the general capacitor, as the switching speed of electronic components continues to increase, when the operating frequency is higher than the natural frequency of the capacitor. , the parasitic inductance effect that increases as the frequency increases will cause the decoupling capacitor that originally provided a low-impedance path to filter out high-frequency noise to gradually lose its decoupling effect as the frequency increases

Images