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Heat resisting polyimides / polyhedral oligomeric silsesquioxane nano hybridization material

A technology of polysilsesquioxane and nano-hybrid materials is applied in the field of materials, which can solve the problems that the performance of pure polyimide cannot meet the requirements, and achieve the effects of improving performance, improving thermal performance and broad application prospects.

Inactive Publication Date: 2009-04-22
TORAY FIBER RES INST(CHINA) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the rapid development of aerospace, military and other industries in recent years, higher requirements have been placed on the performance of high-temperature resistant materials for devices, and the performance of pure polyimide can no longer meet the requirements.

Method used

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  • Heat resisting polyimides / polyhedral oligomeric silsesquioxane nano hybridization material
  • Heat resisting polyimides / polyhedral oligomeric silsesquioxane nano hybridization material
  • Heat resisting polyimides / polyhedral oligomeric silsesquioxane nano hybridization material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037]Dissolve 1.3g of octaaminophenylsilsesquioxane (OAPS for short) in 15ml of N-methylpyrrolidone (NMP for short). After fully dissolving, slowly drop into 10ml of A NMP solution of 2.9 g of benzophenonetetracarboxylic dianhydride (BTDA); after the dropwise addition, react at 30° C. for 1 hour under a nitrogen atmosphere to obtain a polyhedral oligomeric silsesquioxane solution with an anhydride functional group;

[0038] Take 2.0g of 4,4'-diaminodiphenyl ether (ODA) monomer and dissolve it in 30ml of NMP. After fully dissolving, add 1.0ml of the polyhedral oligomeric silsesquioxane solution with anhydride functional groups dropwise; Then add 3.2g BTDA, and the feeding time is controlled at 60 minutes. After the feeding is completed, react at 20°C for 20 hours under a nitrogen atmosphere to obtain a uniform polyamic acid solution with a solid content of 0.18g / ml;

[0039] The above polyamic acid solution was formed into a film on a glass plate, and imidization treatment was...

Embodiment 2

[0041] According to the method of Example 1, the amount of ODA and additional BTDA was adjusted so that the content of OAPS in the polyimide / oligomeric silsesquioxane nano-hybrid film was 3.0 wt%. The added mass percentages of the reaction monomers in the film are BTDA 61.1wt% and ODA 35.9wt%.

Embodiment 3

[0043] According to the method of Example 1, the amount of ODA and additional BTDA was adjusted so that the content of OAPS in the polyimide / oligomeric silsesquioxane nano-hybrid film was 5.0 wt%. The added mass percentages of the reaction monomers in the film are 60.7wt% of BTDA and 34.3wt% of ODA.

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Abstract

The invention discloses a heat-resistant polyimide / polyhedral oligomeric silsesquioxane nanometer hybrid material. The glass transition temperature of the heat-resistant polyimide can be adjusted by changing the content of polyhedral oligomeric silsesquioxane. The invention also discloses a method for preparing the heat-resistant polyimide / polyhedral oligomeric silsesquioxane nanometer hybrid material, and obtains an organic / inorganic hybrid material with nano-dispersion. The heat-resistant polyimide has excellent thermal properties, widens the application of polyimide-type materials in the aspects of aerospace, aviation, high-temperature resistant coatings, high-temperature resistant heat-insulation foaming materials, high-temperature structural adhesive and the like, and endows the polyimide-type materials with broad application prospects.

Description

technical field [0001] The invention belongs to the field of material technology, and in particular relates to a heat-resistant polyimide / polyhedral oligomeric silsesquioxane nano-hybrid material and a preparation method thereof. Background technique [0002] Polyimide, because of its outstanding characteristics in performance and synthesis, whether it is used as a structural material or as a functional material, its huge application prospects have been fully recognized. It has high thermal stability, high strength and high modulus, low thermal expansion coefficient and dielectric constant, excellent insulation performance and solvent resistance, etc., and is widely used in aerospace, military, electrical and electronic and other industrial fields. However, with the rapid development of aerospace, military and other industries in recent years, higher requirements have been placed on the performance of high-temperature resistant materials for devices, and the performance of p...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K5/541C08G73/10
Inventor 杨扬陈桥吴刚
Owner TORAY FIBER RES INST(CHINA) CO LTD
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