Addition type heat conducting silicon rubber and manufacturing method thereof

Abstract

The invention relates to an addition type heat-conducting silicone rubber and a preparation method thereof. The addition type heat-conducting silicone rubber is characterized in that 100 weight portions of vinyl silicone oil and 200 weight portions to 500 weight portions of heat-conducting material are dewatered and mixed in a vacuum kneader for 30 to 200 minutes with the temperature of 100 to 150 DEG C and the vacuum degree of 0.06 to 0.099 MPa so as to obtain base material; under normal temperature, 0.5 weight portion to 1.5 weight portions of hydrogeneous silicone oil, 0.01 weight portion to 0.06 weight portion of inhibitor and 3 weight portions to 10 weight portions of diluent are added and stirred in a stirrer for 15 to 40 minutes so as to obtain A glue; 100 weight portions of base material are taken, 0.25 weight to 0.75 weight portion of platinum catalyst and 3 weight portions to 10 weight portions are added and stirred in the stirrer for 15 to 40 minutes so as to obtain B glue. The A glue and the B glue with the same weight portions are taken, mixed evenly and defoamed for 3 to 10 minutes at the vacuum degree of 0.06 to 0.09 MPa so as to obtain addition type heat-conducting silicone rubber. The heat-conducting silicone rubber is cured at normal temperature or low temperature, has good flow property and convenient use, has higher heat conductivity after fluidization and can be used for the components with the need of heat dissipation and heat transmission in the electronic appliance field.

Description

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AI Technical Summary

Benefits of technology

This new type of silicon carbide (SiC) composite materials made by adding specific amounts of metal oxides or other substance into an organopolysiloxane resin matrix were found to exhibit better thermal conductivities than traditional composites without any extra ingredients like ceramic powders. These improved qualifications include good fluid behavior during injection moldings with minimal shrinkage upon solidification, low water absorption on agitation caused by solvent evaporation, easy handling when mixed together, no damaging effect on electronic devices, etc., making them suitable for various applications such as semiconductor packaging, power transmission systems, automotives, energy storage units, sensors, medical equipment, and others that require reliable connections between different elements within these products.

Problems solved by technology

This patented technical problem addressed by this patent relates to improving the efficiency and effectiveness of electronics packaging due to their compact size and vulnerable parts such as integrated circuit (IC) chips. To address this issue, there was developed a new type called PHOSPACR™ where certain chemicals were added during manufacturing process to improve its quality control over the final product's physical characteristics. However, current methods require expensive equipment like vacuum systems, resulting in increased costs associated with maintaining stable conditions within the production line.

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