Absorption ultrasonic tool head applied for connecting the polymers micro-devices
A micro-device and tool head technology, which is applied in the field of polymer micro-device assembly, can solve unconsidered problems, do not have parts clamping and fixing functions, etc., and achieve improved processing quality, uniform welding and uniform vibration of the radiation surface Effect
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[0012] The specific embodiments of the present invention will be described in detail below with reference to the technical solutions and the accompanying drawings.
[0013] There is a threaded hole 2 on the top of the main body 1 of the ultrasonic tool head for connecting the transducer; the protruding position 4 in the middle is the node position, and the theoretical vibration amplitude of this position is zero, which is used to clamp the entire ultrasonic tool head and fix it with This position applies welding pressure to the device to be connected; the end of the ultrasonic tool head is the ultrasonic radiation surface 10, and the design of the overall structure ensures that the amplitude distribution of the surface is uniform; this surface is provided with a device fixing structure 5 and an adsorption clamping structure 9, the fixing structure 5 is located in the center of the ultrasonic radiation surface 10, and the adsorption and clamping structure 9 is symmetrically dist...
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