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Semiconductor device

A conductive layer and contact pad technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve unsolved problems, and achieve the effect of avoiding uneven contact resistance and tight bonding

Inactive Publication Date: 2009-03-04
HANNSTAR DISPLAY CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, U.S. Patent No. 7,176,583 and Application No. 2007 / 0023919 did not solve the problems of cracking of the passivation protective layer and cracking of the metal film in the known glass flip-chip technology

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

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Embodiment Construction

[0019] An electronic component or semiconductor device with conductive bumps disclosed in the present invention will be described below with reference to related figures.

[0020] see figure 1 , which is a preferred embodiment designed according to the present invention, which is an electronic component or a semiconductor device with conductive bumps. For the convenience of description, in this embodiment, a liquid crystal display is taken as a representative, which includes a liquid crystal display area 104 , a driving circuit 102 a for glass flip-chip bonding, and a driving circuit 102 b for film flip-chip bonding. Wherein, the liquid crystal display area 104 and the driving circuit 102a are arranged on the middle area and the peripheral area of ​​the glass substrate 100 respectively, and the driving circuit 102b is arranged on the flexible film and connected with the glass substrate 100 and the printed circuit board 106 .

[0021] Please refer to Figure 2, which is the abo...

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Abstract

The invention provides an electronic component or semiconductor device provided with conduction projections, comprising an organic buffer layer provided with undercut structure. The buffer layer can lead to deformation in a joint process so as to make up for defective joint due to the height difference between projections; in addition, an adhesive is also provided between an integrated circuit chip and a basal plate and partially permeates into the undercut structure, thus not only increasing adhesion area to strengthen the adhesion force between the integrated circuit chip and the basal plate, but also dispersing part of pressure in junction to reduce the resiliency of the adhesive generated between the circuit chip and the basal plate.

Description

technical field [0001] The invention relates to an electronic component or a semiconductor device with a conductive bump, in particular to an electronic component or a semiconductor device with a conductive bump with an undercut structure and a balancing function. Background technique [0002] In the process application field of manufacturing electronic components or semiconductor devices, many complex manufacturing procedures are included, especially the process of liquid crystal display (Liquid Crystal Display, LCD). Generally speaking, a liquid crystal display is formed by bonding many liquid crystal display driver chips and chips of peripheral driving and control circuits to a glass substrate, and the contact pads on the chip must be correctly aligned with the wires on the glass substrate. Accurate bonding, and provide good conductivity, so that the liquid crystal display can display correct images through good signal transmission. [0003] In order to achieve the above...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/485
CPCH01L2924/0002H01L2224/13
Inventor 汤宝云孙伟豪
Owner HANNSTAR DISPLAY CORPORATION
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