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Encapsulation method for top radiation organic EL part

An encapsulation method and top emission technology, which can be applied to electric solid devices, electrical components, semiconductor devices, etc., can solve problems such as device cathode wear, and achieve the effects of low cost, simple process and short curing time.

Inactive Publication Date: 2009-02-04
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure a certain degree of light transmission, the metal cathodes of top-emitting organic electroluminescent devices are usually made very thin; at the same time, in order to achieve full-color display, the packaging of the device involves the registration of the color filter film. When some packaging methods are aligned, the cathode of the device is easily worn due to the existence of friction

Method used

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  • Encapsulation method for top radiation organic EL part

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Comparison scheme
Effect test

Embodiment 1

[0024] The preparation of the device is carried out in a multi-source organic molecular vapor deposition system. The detailed preparation process is as follows:

[0025] [1] The silicon substrate is repeatedly scrubbed with acetone, ethanol, and deionized water in sequence, ultrasonically, and then dried;

[0026] [2] Place the processed substrate in a multi-source organic molecular vapor deposition system (see Chinese patent: ZL03110977.2, "Crucible evaporation source for organic electroluminescence coating machine"), the same The vacuum chamber contains an organic evaporation area (8 evaporation sources) and a metal evaporation area (2 evaporation sources). The two areas and each evaporation source are isolated from each other to avoid mutual contamination. The substrate can be rotated to the organic evaporation area separately. The evaporation area or the upper part of the metal evaporation area is convenient for the growth of materials. The substrate is 25cm away from the ...

Embodiment 2

[0034] The preparation of the device is carried out in a multi-source organic molecular vapor deposition system. The detailed preparation process is as follows:

[0035] [1] The silicon substrate is repeatedly scrubbed with acetone, ethanol, and deionized water in sequence, ultrasonically, and then dried;

[0036] [2] Place the processed substrate in a multi-source organic molecular vapor deposition system. The same vacuum chamber of the system contains an organic evaporation area (8 evaporation sources) and a metal evaporation area (2 evaporation sources). The areas and the evaporation sources are isolated from each other to avoid mutual pollution. The substrate can be rotated to the upper part of the organic evaporation area or the metal evaporation area to facilitate the growth of materials. The substrate is 25cm away from the evaporation source and can rotate and revolve to ensure The uniformity of the metal film and the organic film, the materials used are placed in diffe...

Embodiment 3

[0043] The preparation of the device is carried out in a multi-source organic molecular vapor deposition system. The detailed preparation process is as follows:

[0044] [1] The silicon substrate is repeatedly scrubbed with acetone, ethanol, and deionized water in sequence, ultrasonically, and then dried;

[0045] [2] Place the processed substrate in a multi-source organic molecular vapor deposition system. The same vacuum chamber of the system contains an organic evaporation area (8 evaporation sources) and a metal evaporation area (2 evaporation sources). The areas and the evaporation sources are isolated from each other to avoid mutual pollution. The substrate can be rotated to the upper part of the organic evaporation area or the metal evaporation area to facilitate the growth of materials. The substrate is 25cm away from the evaporation source and can rotate and revolve to ensure The uniformity of the metal film and the organic film, the materials used are placed in diffe...

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Abstract

The invention belongs to the organic electroluminescence field, in particular to a packaging method for a top-emitting organic electroluminescent device, comprising the packaging to the top-emitting organic electroluminescent device having an upright structure and an inverted structure. A layer of organic or inorganic material which has a thickness of 10nm to 100nm and has high transmittance in a visible light region and is also easy of thermal evaporation deposition is coated on a top electrode of the top-emitting organic electroluminescent device to serve as a protective layer of the device, then a luminous zone of the device is coated with package resin, and finally a transparent packaging cover plate is pressed thereon. The method improves the packaging tightness of the device, avoids the damage to the device caused by friction, and overcomes the disadvantages of complicated operational procedures, long solidification time and high costs of the previous packaging process, and the method has advantages of simple process, short solidification time, low costs and good barrier property of oxygen and vapor, and is widely applied in the aspect of packaging to electronic and electrical devices such as organic electroluminescent devices (OLED).

Description

technical field [0001] The invention belongs to the field of organic electroluminescence, and in particular relates to a new packaging method for top-emitting organic electroluminescence devices. Background technique [0002] Organic electroluminescent device (OLED) is a new type of flat display device newly developed at present. Because OLED can meet all the needs of people for displays, that is, it has the advantages of self-illumination, thinness, fast response, wide viewing angle, large-screen display, low-voltage DC drive, simple process, low cost, and flexible display. Therefore, It is considered to be the most ideal and most promising next-generation display technology. At present, there are two types of active OLED light-emitting structures: bottom-emitting and top-emitting. The anode ITO of the bottom-emitting device is below, followed by the OLED organic light-emitting layer, and the top is the metal or alloy cathode. In electroluminescence, light exits from the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56
Inventor 薛钦赵毅鲁建华杜寰陈平刘式墉
Owner JILIN UNIV
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