Method for preparing crystal round back electrode and crystal round

Abstract

The invention discloses a wafer whose back side is coated with adhesive through adopting the silk screen printing and a process for preparing a back electrode of the wafer, the preparation process comprises the following five steps: preparing a wafer, and keeping the wafer flat in the subsequent steps, adopting the silk screen printing to coat the adhesive on the back side of the wafer and drying, arranging the wafer which is coated with the adhesive on a scribing blue film, separating, adhering and solidifying the separated wafer. The process eliminates the flanging phenomenon which easily occurs during the preparation of the wafer, the dosage of bonding slurry is reduced by one-third, the cost of the bonding slurry is greatly reduced by about ten percent, and the flatness of the coating surface of a back electrode of the chip is guaranteed, a scribing is easily cut, the intensity of the combination between the chip and the electrode during the eutectic welding is guaranteed, and the production time and cost are greatly saved. The wafer whose back side is coated with the adhesive of the invention can be stored for a long time, and the control to the quality of the stock is improved.

Description

technical field [0001] The invention relates to a manufacturing method of a wafer back electrode and a wafer thereof, in particular to a method for coating adhesive on the back of the wafer by screen printing. Background technique [0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on silicon wafers, and become IC products with specific electrical functions. With the rapid development of electronic products, wafers are widely used to make FH431 voltage reference power supply and power MOS devices, etc., mainly used in computer motherboards, voltage monitors, voltage reference power supplies, switching power supplies (reference voltage), chargers and other consumption electronics field. FH431 adjustable voltage reference power supply and power MOS devices have become important semiconductor power device...

AI Technical Summary

Problems solved by technology

Since the conductive adhesive and the base are connected together, chain reactions are likely to occur during the packaging process, that is, the quality of the connection between the conductive adhesive and the base will directly affect the final electrical performance of the product, which will lead to poor pass rate of dispensing products. Stable; on the other hand, compared with the eutectic chip bonding method adopted by the diode and triode, the production speed will be much slower and the output per unit time will be reduced, which is to improve production efficiency and reduce production A technical bottleneck of cost; and the fluidity of the glue is low, and the edge phenomenon is unavoidable

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