Perforating die of flexible heat controlled thin film

Abstract

The invention relates to a flexible thermal control film punching die which comprises a female die 6 with two rows of cutting edges, and a male die 15; wherein, the female die 6 is fixedly arranged on a lower plane plate 7 by a first positioning pin 20 and a first internal hexagonal head screw 19; a supporting plate 22 is arranged on the lower plane plate 7; a bottom plate 24 is fixed on the supporting plate 22 by a first screw 23; a tight roll 21 is arranged on the supporting plate 22; guide poles 11 are arranged on the lower plane plate 7 by guide sleeves 13; a connecting plate 8 is arranged at the lower end of each guide pole 11; the lower plane plate 7 and the female die 6 are correspondingly provided with through holes; the male die 15 and the female die 6 are correspondingly arranged on a fixing plate 5; a pressing cover 2, a pressing plate 3 and the fixing plate 5 are arranged on the guide poles 11 by pressing sleeves 10; strengthening ribs 4 are arranged on the pressing plate 3. One motion of the flexible thermal control film punching die can lead to the punching of two rows of holes without interruption. A four-guide-pole positioning structure of the four guide poles is adopted for the flexible thermal control film punching die, with high positioning precision ensured; certain side force is applied to the four guide poles, the guiding of each guide pole employs dry friction, and films can not be polluted by oil in the process of punching. The films retain smooth and have suitable tensile force without being folded in the process of punching.

Description

technical field [0001] The invention relates to the technical field of a special high-efficiency punching die for a flexible thermal control film, in particular to a punching die for a flexible thermal control film. Background technique [0002] At present, the high-precision micro-hole processing is processed by excimer laser, YAG high-frequency laser, plasma and other methods, but the processing operation is complicated, the processing speed is slow and it is not suitable for mass production. The most important thing is that there is a marginal effect formed by laser and plasma sintering on the edge of the hole, which causes quality problems for the coating film in the next process. Although a Japanese company has developed a method of chemically etching thin films, it can simultaneously process large holes, small holes, and through holes. With blind holes, and gap slots, but the thin film etchant used is a well (hydrazine)-based etchant, which has problems such as toxicit...

AI Technical Summary

Problems solved by technology

[0002] At present, the high-precision micro-hole processing is processed by excimer laser, YAG high-frequency laser, plasma and other methods, but the processing operation is complicated, the processing speed is slow and it is not suitable for mass production

The most important thing is that there is a marginal effect formed by laser and plasma sintering on the edge of the hole, which causes quality problems for the coating film in the next process. Although a Japanese company has developed a method of chemically etching thin films, it can simultaneously process large holes, small holes, and through holes. With blind holes, and gap slots, but the thin film etchant is a trap (hydrazine) etchant, which has problems such as toxicity, poor stability, and low ignition point.

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