Method for simulating hot test chip thermal resistance value

Abstract

The invention discloses a method used for simulating the thermal resistance value of a thermal test chip, evaluating the correlation between the thermal resistance value of a heating block and the thermal resistance value of the thermal test chip and finding the size of the heating block that fits for heat generating situations of actual chips. Furthermore, after implementing the radiating performance test of the heating block, the method also can improve the reliability of test results by validating that whether the relation between a transient response value of the thermal resistance of the heating block and a steady response value of the thermal resistance of the thermal test chip lies in a preset variation range.

Description

technical field [0001] The invention relates to a heat dissipation performance test method, and in particular to a heat dissipation performance test method which uses a heating block to simulate a thermal test chip and find out the size of the heating block. Background technique [0002] In the current computer system, the work performance and frequency of the central processing unit continue to increase, and the heat dissipation problem has become the focus of each design, and the coordination between the heat dissipation performance of the heat dissipation module and the heat density of the central processing unit has begun to be considered. . [0003] When an engineer starts to design a cooling module in a host computer or server, first of all, according to the space planning in the host computer or server (circuit layout, main heating element, hard disk drive, interface card location... etc.) and the heat dissipation effect to be achieved, a set of heat dissipation modu...

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Problems solved by technology

At the same time, the heating power of the thermal test chip will also increase with the increase of the operating frequency, and factors such as changes in the ambient temperature and contact pressure errors will also directly affect the instability of the test results. When testing the heat dissipation performance of the heat dissipation module, since the heating block used is of a single size, it cannot truly show the heating state and thermal resistance of the thermal test chip, so it is difficult to ensure the heat dissipation quality of the heat dissipation module after mass production

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