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Packaging method for improving LED external quantum efficiency and LED packaging structure

A technology of external quantum efficiency and packaging method, which is applied in the field of packaging method and LED packaging structure to improve LED external quantum efficiency, can solve the problems of low light output efficiency of LED packaging, reduce plane total reflection, improve light output efficiency, and reduce light emission. The effect of energy loss

Active Publication Date: 2011-02-09
WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a packaging method for improving the external quantum efficiency of LEDs, aiming at solving the problem of low light extraction efficiency of existing LED packages

Method used

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  • Packaging method for improving LED external quantum efficiency and LED packaging structure
  • Packaging method for improving LED external quantum efficiency and LED packaging structure

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Embodiment Construction

[0010] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the examples of the present invention, and are not intended to limit the examples of the present invention.

[0011] Please refer to the accompanying drawings, which is a preferred embodiment of the present invention. The LED packaging structure includes a bracket reflective cup 10 , a light-emitting chip 30 packaged at the bottom of the bracket reflective cup 10 and fluorescent colloid 20 filled in the bracket reflective cup 10 . The center of the support reflector cup 10 is recessed inward to form a trumpet shape with a small inside and a large outside, and several microstructures 40 are formed on the light-emitting surface of the ...

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Abstract

The invention relates to a packaging method for improving the LED outer quantum efficiency and a LED packaging structure. The lighting chip is installed at the bottom of the bracket reflective cup; the electrode of the lighting chip is guided to the bracket electrode; the fluorescent colloid is cast in the bracket reflective cup for solidifying the chip; a plurality of miniature structures are formed on the lighting surface of the colloid via the transparent glue mixed miniature spherical grains. The LED packaging structure comprises a bracket reflective cup, a lighting chip packed at the bottom of the bracket reflective cup, a fluorescent colloid cast in the bracket reflective cup; the fluorescent colloid is formed with a plurality of miniature structures on the lighting surface. In thatway, the invention can reduce the planar full-reflective effect for the fluorescent colloid and the lost of the light energy, and the invention also can enhance the LED light efficiency, in the otherwords enhancing the outer quantum efficiency.

Description

technical field [0001] The invention belongs to the field of light-emitting diode packaging, and in particular relates to a packaging method and an LED packaging structure for improving the external quantum efficiency of LEDs. Background technique [0002] With the continuous expansion of applications of LEDs (light-emitting diodes, light-emitting diodes), the requirements for luminous efficiency of LED packaging are also getting higher and higher, and luminous efficiency is the most important parameter for determining LED packaging. The luminous efficiency of LED includes two parts: internal quantum efficiency and external quantum efficiency. The internal quantum efficiency refers to the efficiency of the electron-hole pairs of the LED chip recombining in the PN junction region of the LED chip to generate photons and emit the chip surface; the external quantum efficiency refers to the total efficiency after the photons emitted by the LED chip are drawn out of the LED packag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/54
Inventor 周春生
Owner WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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