Soft and hard composite circuit board and manufacturing method thereof

Abstract

The invention provides a rigid-flex composite circuit board which is applicable to the manufacturing technical field of an integrated circuit plate. The rigid-flex composite circuit board comprises a hard board area and a soft board area. The hard board area comprises a hard board and a flexible board that stick to each other. Both the hard board and the flexible board are provided with a circuit. The soft board area comprises the flexible board that is also provided with the circuit. The flexible board of the hard board area is arranged on the outer surface of the hard board. The flexible board of the hard board area combines the flexible board of the soft board area as a whole, thus facilitating the arrangement of a blind hole or a buried hole according to the needs. So cost is saved and the application scope of the rigid-flex composite board is effectively improved. The invention also provides a method for manufacturing the rigid-flex composite circuit board. The hard board is cut at first and the circuit is arranged on the hard board. Afterwards, the flexible board sticks to the outer surface of the hard board. At last, an outer circuit is arranged on the flexible board. In the method, the hard board is positioned on the inner layer of the hard board, thereby facilitating the arrangement of the blind hole or the buried hole according to the needs.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit board manufacturing, and in particular relates to a soft-hard composite circuit board and a manufacturing method thereof. Background technique [0002] Integrated circuit board is an indispensable key component in electronic products, therefore, the design of integrated circuit board will directly affect the quality of electronic products. Existing integrated circuit boards are mainly divided into two types, one is a rigid circuit board, namely a PCB board; the other is a flexible circuit board, namely an FPC board. Due to the diversification of product functions, most integrated circuit boards need to make circuits on the soft board and hard board respectively, and then use soldering to realize the electrical performance connection of the soft board circuit and the hard board circuit. This connection method has a high requirement on the accuracy of welding, which requires more time an...

AI Technical Summary

Problems solved by technology

[0004] The defect of the existing soft-hard composite circuit board technology mainly lies in: it is often necessary to open blind holes or buried holes in the composite circuit board during production, and in this technology, the soft board 12' is arranged on the inner layer, and the hard board 11' is arranged on the outside. layer, which makes the blind or buried holes must be set on the flexible board 12', and the blind or buried holes that meet the process requirements in the flexible board 12' must be realized by expensive laser equipment, and the difficulty of opening is relatively high. Large, even leading to the failure to open the required blind or buried holes on some soft and hard composite boards

This obviously increases the cost, limits the application range of soft and rigid composite board technology, and hinders the further development of this technology.

Images