Multilevel semiconductor cascade refrigeration element and refrigeration thermopile

Abstract

The present invention discloses a multilevel semiconductor cascade refrigeration element and refrigeration thermopile. Multilevel semiconductor cascade refrigeration element is cascaded from the first level to the nth level refrigeration galvanic, each level of refrigeration galvanic comprises of p type semiconductor and n type semiconductor in paired, the cold end on the top of the first refrigeration galvanic has connection tablet to connect heat-conducting plate of cold end, the hot end on the bottom of Nth level refrigeration galvanic has hot end connection tablet to connect heat-conducting plate of hot end. Wherein, the section of each of level refrigeration galvanic is identical, and the length of galvanic arm becomes shorter and shorter from the first level to the Nth. Connection tablet are set among all refrigeration galvanic cascade surfaces, and levels of refrigeration galvanic connected by electrical connection in parallel and hot connection in series. Because in the refrigeration galvanic employing non-isolength galvanic arm multilevel cascade structure type, insulation layer isn't between levels, additional heat transfer thermal resistance and thermal leak loss between levels are reduced, so the refrigeration capability of multilevel refrigeration element and thermopile are enhanced efficiently.

Description

technical field [0001] The invention relates to a semiconductor cooling element and a combined cooling thermopile, in particular to a multi-stage semiconductor cascaded cooling element and a combined cooling thermopile. Background technique [0002] Semiconductor refrigeration elements (such as semiconductor refrigeration chips) have the characteristics of simple structure, compactness and rapid cooling, and are widely used in refrigeration devices in commercial, electronic, medical, military and aerospace fields. Generally, the maximum cooling temperature difference that can be generated by a single-stage semiconductor cooling element is around 70°C. The main disadvantage of semiconductor refrigeration is its low refrigeration performance coefficient, which is mainly caused by the small figure of merit of the current thermoelectric materials. In semiconductor cooling elements using single-stage galvanic cooling, as the cooling temperature (cold junction temperature) decrea...

AI Technical Summary

Problems solved by technology

However, in this pagoda structure, when the circuit connection is in series, a layer of electrical insulation and heat conduction layer is required between the stages, which increases the additional heat transfer resistance; although parallel circuit connections can be used, the stage and stage There is no need for electrical insulation and heat conduction layers between them, but the pagoda structure itself will also cause a large heat leakage loss

All in all, the substantive improvement of the refrigeration performance of the pagoda-type multi-stage semiconductor refrigeration element will be limited to a certain extent

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