Thermosetting composition for sealing organic el element

Abstract

To provide a thermosetting composition for organic EL device sealing that attains sealing without detriment to the organic EL device so that the occurrence / growth of dark spots is surely inhibited with high transmittance retained to thereby maintain stable emission performance over a prolonged period of time. [MEANS FOR SOLVING PROBLEMS] Sealing of organic EL device is carried out by the use of acomposition comprising as main components 100 pts.wt. of low-molecular-weight epoxy resin of 200 to 2000 molecular weight (A) having at least two glycidyl groups per molecule; 40 to 150 pts.wt. of high-molecular-weight epoxy resin of 20,000 to 100,000 molecular weight (B) having a bisphenol A or bisphenol F skeleton; per 100 pts.wt. of the sum of component (A) and component (B), 0.5 to 20 pts.wt.of latent imidazole compound (C) having a nitrile group; and 0.1 to 10 pts.wt. of silane coupling agent (D).

Description

Thermosetting composition for organic EL device sealing technical field The invention relates to a thermosetting composition for sealing an organic EL component, and the organic EL component can emit light with high brightness by applying an electric field. More specifically, it relates to a thermosetting composition, which fully covers the organic EL components formed on the substrate to protect the organic EL components from being affected by moisture and other factors. Background technique The organic EL element is a polycrystalline semiconductor device (device), which is used in a backlight of a liquid crystal that emits light with high brightness at a low voltage, and is expected to be a thin flat panel display device. However, the resistance of organic EL components to moisture is very poor. When the interface between the metal electrode and the organic EL layer is affected by moisture, peeling may occur, the metal will be oxidized to cause high resistance, and the o...

AI Technical Summary

Problems solved by technology

It is extremely difficult to adhere the display part completely without air bubbles, and the mixing of air bubbles is one of the reasons for shortening the durability period.

In addition, when using liquid resin to perform multi-bevel processing on the substrate glass (motherglass), since it is necessary to mask the non-bonding part, the workability will be reduced