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Low silver oxidation resistance active leadless solder

An anti-oxidation activity, lead-free solder technology, applied in the direction of welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problem of high silver content of lead-free solder, low silver anti-oxidation activity, high production cost, etc. problem, to achieve the effect of less silver content, lower activity, and lower production cost

Inactive Publication Date: 2008-07-09
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low-silver anti-oxidation active lead-free solder to solve the problems of high silver content, high production cost and poor wettability of the existing lead-free solder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0006] Embodiment 1: In this embodiment, the low-silver anti-oxidation active lead-free solder is composed of the following components by mass percentage: 0.5-2.5% Ag, 0.3-1.5% Cu, 0.002-0.2% P, 0.01-1.0% Zn , 0.02-3.0% Ti, 0.01-2.5% Zr, 0.01-3.5% Ni, 0.02-1.5% mixed RE, and the rest is Sn. The mixed RE is a commercially available Ce and La-based mixed rare earth with a mass ratio of Ce to La of 5:4.

[0007] Compared with the existing Sn-Ag-Cu solder, the low-silver anti-oxidation active lead-free solder of the present invention, under the same conditions, the wetting angle is reduced by 5° to 7°, and the oxidation resistance is increased by 14% to 20%. , the creep strength is increased by 6% to 10%, and joints with high reliability can be obtained in brazing. Cu and Zn added in the present invention form a stable Cu-Zn compound, which reduces the activity of Zn elements. Rare earth elements Adding helps to improve the wettability of solder.

specific Embodiment approach 2

[0008] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the low-silver anti-oxidation active lead-free solder is composed of the following components by mass percentage: 1.5% Ag, 0.9% Cu, 0.015% P, 0.15% Zn, 1.0 %Ti, 0.75% Zr, 1.8% Ni and 0.15% mixed RE, the rest is Sn.

[0009] The lead-free solder obtained in this embodiment has a solidus temperature of 211° C. and a liquidus temperature of 224° C., and has good wetting and spreading properties on Cu plates, Ni plates, and inert substrates (such as ceramics). It shows good brazing process performance. Compared with the common Sn-Ag-Cu solder, under the same conditions, the wetting angle is reduced by 5°-7°, the oxidation resistance is increased by 14%-20%, and the creep resistance The variable strength is increased by 7% to 10%, and a joint with high reliability can be obtained in brazing.

specific Embodiment approach 3

[0010] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the low-silver anti-oxidation active lead-free solder is composed of the following components by mass percentage: 1.0% Ag, 0.9% Cu, 0.018% P, 0.15% Zn, 1.0% %Ti, 0.75% Zr, 1.8% Ni and 0.15% mixed RE, the rest is Sn.

[0011] The lead-free solder obtained in this embodiment has a solidus temperature of 209° C. and a liquidus temperature of 223° C., and has good wetting and spreading properties on Cu plates, Ni plates, and inert substrates (such as ceramics). It shows good brazing process performance. Compared with the common Sn-Ag-Cu solder, under the same conditions, the wetting angle is reduced by 4°-7°, the oxidation resistance is increased by 15%-20%, and the creep resistance The variable strength is increased by 6% to 10%, and a joint with high reliability can be obtained in brazing.

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Abstract

A lower-Ag anti-oxidation lead-free solder relates to a lead-free solder. The invention solves the problems of high Ag content, high manufacture cost and poor wettability of the existing lead-free solder. The invention consists of the following components according to a weight percentage of 0.5 to 2.5 percent of Ag, 0.3 to 1.5 percent of Cu, 0.002 to 0.2 percent of P, 0.01 to 1.0 percent of Zn, 0.02 to 3.0 percent of Ti, 0.01 to 2.5 percent of Zr, 0.01 to 3.5 percent of Ni, 0.02 to 1.5 percent of mixed RE and the rest is Sn. Compared with the existing Sn-Ag-Cu solder under a same condition, the wetting angle of the lower-sliver anti-oxidation lead-free solder of the invention is reduced by 5 to 7 degrees, the anti-oxidation performance is improved by 14 to 20 percent and the creep strength is improved by 6 to 10 percent; thereby being able to acquire a joint with higher reliability from braze welding. The invention has the advantages of few Ag content and low manufacture cost.

Description

technical field [0001] The invention relates to a lead-free solder. Background technique [0002] In the process of electronic packaging, Sn-Ag-Cu alloy solder is widely used. According to the report of IPC2000, Sn-Ag-Cu alloy will become the most potential substitute of Sn-Pb solder. However, the existing solder has poor wettability, and the Ag content in the alloy is relatively high, most of which are between 3% and 5% (mass), which will inevitably increase the cost in actual production and application. Therefore, improving the wettability of solder and reducing the content of Ag without affecting other properties of solder will promote the wider application of Sn-Ag-Cu alloy solder, which is also the goal of solder manufacturers and related researchers . Contents of the invention [0003] The object of the present invention is to provide a low-silver anti-oxidation active lead-free solder to solve the problems of high silver content, high production cost and poor wett...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 何鹏冯吉才刘多
Owner HARBIN INST OF TECH
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