Surface pressure distribution sensor

Abstract

A Specific pressure distribution sensor which is high in wiring reliability even in a structure having a folded portion, can accurately and constantly detect a specific pressure distribution, and can be produced at low costs with a simple constitution. A first lead-out wiring group is formed adjacent to a first wiring group on a first substrate, a second lead-out group connected with a second siring group is formed on a second substrate, the second lead-out wiring group is formed to extend via a boundary portion and is connected with the first lead-out wiring group on the first substrate side, the conductor width of the first lead-out wiring group is formed to be smaller than the conductor width of the first wiring group and the conductor width of the second wiring group, and the conductor width of the second lead-out wiring group positioned at the folded portion of the boundary portion is formed to be larger than the conductor width of the first lead-out wiring group.

Description

technical field [0001] The present invention relates to a surface pressure distribution sensor for measuring fine unevenness and the like of an object to be measured. Background technique [0002] As is well known, a surface pressure distribution sensor that detects fine unevenness on the surface of an object to be measured pressed against a detection surface as a distribution of pressing force converts the surface shape of a rough surface into data. (For example, refer to Patent Document 1) [0003] In a conventionally known surface pressure distribution sensor of this type, for example, as shown in FIG. 8 , semiconductor switching elements 101 are arranged in a matrix on a substrate, and electrodes 102 connected to one terminal side of each semiconductor switching element 101 are formed. A flexible film having a conductive film is arranged on the opposing surface of the semiconductor substrate, and is opposed to the electrode 102 with a predetermined interval from the ele...

AI Technical Summary

Problems solved by technology

[0012] In addition, in order to accurately measure the surface pressure of a minute area according to the use of a fingerprint sensor, etc., it is necessary to make the row wiring 111 and the column wiring 113 fine, and to suppress the substrate area as much as possible. Fine wiring, if it becomes fine wiring, the durability of the wiring is likely to suffer from the stress during bending, and there is a problem that the reliability of the wiring is reduced.

Images