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Semi-conductor silicon chip liquid stage source diffusion furnace

A diffusion furnace and liquid source technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low production efficiency and poor diffusion uniformity, achieve high production efficiency, uniform diffusion, and solve the problem of uneven diffusion of gas sources. uniform effect

Inactive Publication Date: 2008-03-05
SHANGHAI AEROSPACE AUTOMOBILE ELECTROMECHANICAL CO LTD +1
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Problems solved by technology

[0004] In order to solve the shortcomings of low production efficiency and poor diffusion uniformity in the prior art, the object of the present invention is to provide a semiconductor silicon wafer liquid source diffusion furnace, which adopts a continuous diffusion method to provide a uniform semiconductor impurity diffusion furnace tube structure

Method used

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  • Semi-conductor silicon chip liquid stage source diffusion furnace

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Embodiment Construction

[0009] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0010] Fig. 1 is a schematic diagram of the structure of a semiconductor silicon wafer liquid source diffusion furnace of the present invention, and Fig. 2 is a view along the direction A of Fig. 1 .

[0011] As shown in the figure, the semiconductor silicon wafer liquid source diffusion furnace of the present invention has an open structure at both ends, and the product can be uniformly doped during the movement of one end and the other end. On the inner wall of the furnace tube are installed 2 to 10 spray source quartz tubes with a diameter of φ2 to φ10mm. The walls of the spray source quartz tubes are distributed with capillary holes of uniform size. The source bottle for the diffusion source. When the source bottle has a certain vapor pressure, the gas carrying the source enters the quartz tube from the source bottle, and enters the diffusion furnace tub...

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Abstract

This invention discloses a diffusion furnace of semiconductor silicon plate liquid source including: a diffusion tube and quartz tubes for spraying the source, in which, the diffusion furnace tube is in a structure of two ends open, 2-10 source-spraying quartz tubes are installed on the internal wall of the tube with the diameter of pha2-pha 10mm, capillary holes in uniform aperture are distributed on the wall of the tube and the exit end of the tube is connected with the source bottle of the liquid state diffusion source.

Description

technical field [0001] The invention relates to manufacturing equipment of semiconductor devices, in particular to a semiconductor silicon wafer liquid source diffusion furnace for performing a diffusion process on silicon wafers. Background technique [0002] Diffusion furnace tube is a thermal processing equipment used for diffusion, oxidation, annealing, alloying and sintering of silicon wafers in the manufacturing process of semiconductor devices and large-scale integrated circuits. At present, the known semiconductor diffusion equipment includes: a diffusion furnace tube and a quartz tube connected at the tail to provide a gas source. The disadvantages of this equipment are as follows: first, the diffusion furnace tube is a single-ended open structure, and the production efficiency is very low because the silicon wafers enter and exit through a single port before and after processing, and the time is relatively long. Second, the entry and exit time of silicon wafers du...

Claims

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Application Information

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IPC IPC(8): H01L21/22H01L21/00
Inventor 符育刚袁晓李红波
Owner SHANGHAI AEROSPACE AUTOMOBILE ELECTROMECHANICAL CO LTD
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