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Plasma film coating device and method

A technology of plasma and coating device, which is used in gaseous chemical plating, metal material coating process, coating and other directions

Active Publication Date: 2008-03-05
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The method of the present invention uses the atmospheric pressure plasma production process, and cooperates with the special plasma source design, which can solve the problems faced by the traditional atmospheric pressure plasma assisted coating production process at present

Method used

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  • Plasma film coating device and method
  • Plasma film coating device and method
  • Plasma film coating device and method

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Embodiment Construction

[0034] Hereinafter, the plasma coating device of the preferred embodiment of the present invention will be described in more detail by using the accompanying drawings. Figures 1a to 1g respectively show cross-sectional views of devices of preferred embodiments, and in each embodiment of the present invention, the same symbols represent the same components.

[0035] Please refer to FIG. 1 a , which shows a schematic diagram of a plasma coating device 100 in a first embodiment. The plasma coating device 100 mainly includes a reaction chamber 110 , a carrier 3 , a plasma source generating device 120 and an exhaust device 130 . The reaction chamber 110 is used to provide an environment for plasma coating. The gas pressure of the reaction chamber 110 can be normal pressure (same as external pressure, eg 760 torr) or low pressure (eg 0.1-1 torr). Furthermore, a carrier 3 is provided in the reaction chamber 110 , and the carrier 3 is used to carry the material to be coated. The mat...

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Abstract

One kind of plasma coating equipment is provided, which includes one reaction chamber; one carrier inside the reaction chamber; one plasma source device over the carrier and including one plasma beam ejector providing one film depositing plasma beam in one angle of 0-90 deg to the normal line of the carrier; and one evacuating device over the carrier and with one evacuating pipe for pumping out particle and side product resulted during forming the film by means of the plasma beam and in one angle of 0-90 deg to the normal line of the carrier.

Description

technical field [0001] The present invention relates to a plasma coating device and a coating method thereof, in particular to an atmospheric pressure plasma coating device and a coating method thereof. Background technique [0002] Coating technology plays a very important role in modern industrial applications. Coating can be achieved by wet or dry methods, and advanced applications generally rely on dry manufacturing processes. Traditional dry coating technologies include physical vapor deposition (physical vapor deposition, PVD), chemical vapor deposition (chemical vapor deposition, CVD), atmospheric pressure (atmospheric pressure) chemical vapor deposition (atmospheric pressure CVD, APCVD), plasma enhanced chemical vapor deposition Deposition (plasma-enhanced CVD, PECVD), metal organic vapor deposition (metal organic CVD, MOCVD), molecular beam epitaxy (MBE), halide vapor phase epitaxy (Halide Vapor Phase Epitaxy, HVPE), evaporation (Evaporation) and many more. In add...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/513C23C16/52
Inventor 张加强吴清吉廖新治林春宏
Owner IND TECH RES INST
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